| Summary: | Among the various reinforcement phases available in Cu-based composites, the unique layered structure and easy diffusion of A-layer atoms make MAX phases more suitable for reinforcing a copper matrix than others. In this study, Cu-coated Ti<sub>3</sub>AlC<sub>2</sub> particles (Cu@Ti<sub>3</sub>AlC<sub>2</sub>) were prepared through electroless plating, and Cu@Ti<sub>3</sub>AlC<sub>2</sub>/Cu composites were fabricated via vacuum hot-press sintering. The phase composition and microstructure of both Cu@Ti<sub>3</sub>AlC<sub>2</sub> powder and composites were characterized using X-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). The results demonstrate the creation of successful electroless copper plating to obtain a Cu coating on Ti<sub>3</sub>AlC<sub>2</sub> particles. At 850 °C, a small amount of Ti<sub>3</sub>AlC<sub>2</sub> particles decompose to form TiCx, while Al atoms from the A layer of MAX phase diffuse into the Cu matrix to form a solid solution with Cu(Al). The test results reveal that the density of the Cu@Ti<sub>3</sub>AlC<sub>2</sub>/Cu composite reaches 98.5%, with a maximum compressive strength of 705 MPa, which is 8.29% higher than that of the Ti<sub>3</sub>AlC<sub>2</sub>/Cu composite. Additionally, the compressive strain reaches 37.6%, representing an increase of 12.24% compared to that exhibited by the Ti<sub>3</sub>AlC<sub>2</sub>/Cu composite.
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