Effects of Mask Material on Lateral Undercut of Silicon Dry Etching

Effects of Mask Material on Lateral Undercut of Silicon Dry Etching

The silicon etching process is a core component of production in the semiconductor industry. Undercut is a nonideal effect in silicon dry etching. A reduced undercut is desired when preparing structures that demand a good sidewall morphology, while an enlarged undercut is conducive to the fabricatio...

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Bibliographic Details
Main Authors: Yongkang Zhang, Zhongxuan Hou, Chaowei Si, Guowei Han, Yongmei Zhao, Xiaorui Lu, Jiahui Liu, Jin Ning, Fuhua Yang
Format: Article
Language:English
Published: MDPI AG 2023-01-01
Series:Micromachines
Subjects:
silicon dry etching
undercut
mask materials
Bosch process
Online Access:https://www.mdpi.com/2072-666X/14/2/306

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