A review on TSV reliability
This paper reviews the reliability of TSV(through silicon via) in three aspects: thermal stress, process and piezoresistive effect. The thermal stress reliability of TSV is reflected in the great difference of thermal expansion coefficient between different materials, too large thermal stress may le...
| Main Authors: | , , |
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| Format: | Article |
| Language: | zho |
| Published: |
National Computer System Engineering Research Institute of China
2021-02-01
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| Series: | Dianzi Jishu Yingyong |
| Subjects: | |
| Online Access: | http://www.chinaaet.com/article/3000128861 |