Testing for Wearability and Reliability of TPU Lamination Method in E-Textiles
Electronic textiles (e-textiles) and wearable computing have been emerging increasingly during the last decade. Since the market interest and predictions have grown, the research into increasing reliability and durability of wearables and e-textiles is developing rapidly. The washability of differen...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-12-01
|
| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/22/1/156 |
| _version_ | 1797497620220870656 |
|---|---|
| author | Paula Veske Frederick Bossuyt Jan Vanfleteren |
| author_facet | Paula Veske Frederick Bossuyt Jan Vanfleteren |
| author_sort | Paula Veske |
| collection | DOAJ |
| description | Electronic textiles (e-textiles) and wearable computing have been emerging increasingly during the last decade. Since the market interest and predictions have grown, the research into increasing reliability and durability of wearables and e-textiles is developing rapidly. The washability of different integration methods and resistance to mechanical stress are the main obstacles being tackled. However, the freedom of movement and overall comfort is still often overlooked during the development phase. It is essential to see the e-textile product as a whole and consider several aspects of user experience. This work will focus on developing and improving the thermoplastic polyurethane (TPU) lamination integration method for e-textiles. In the work, a stretchable copper-polyimide based circuit was laminated onto knit fabric using various TPU films and stacks. The study shares measurable characteristics to determine which material assembly and design would ensure the highest durability for the electronics part without losing its original textile softness, flexibility and stretchability. |
| first_indexed | 2024-03-10T03:21:51Z |
| format | Article |
| id | doaj.art-2d97524652834432b09acaa0c00a5aeb |
| institution | Directory Open Access Journal |
| issn | 1424-8220 |
| language | English |
| last_indexed | 2024-03-10T03:21:51Z |
| publishDate | 2021-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Sensors |
| spelling | doaj.art-2d97524652834432b09acaa0c00a5aeb2023-11-23T12:17:47ZengMDPI AGSensors1424-82202021-12-0122115610.3390/s22010156Testing for Wearability and Reliability of TPU Lamination Method in E-TextilesPaula Veske0Frederick Bossuyt1Jan Vanfleteren2Centre for Microsystems Technology (CMST), Imec and Ghent University, Technologiepark 126, 9052 Gent, BelgiumCentre for Microsystems Technology (CMST), Imec and Ghent University, Technologiepark 126, 9052 Gent, BelgiumCentre for Microsystems Technology (CMST), Imec and Ghent University, Technologiepark 126, 9052 Gent, BelgiumElectronic textiles (e-textiles) and wearable computing have been emerging increasingly during the last decade. Since the market interest and predictions have grown, the research into increasing reliability and durability of wearables and e-textiles is developing rapidly. The washability of different integration methods and resistance to mechanical stress are the main obstacles being tackled. However, the freedom of movement and overall comfort is still often overlooked during the development phase. It is essential to see the e-textile product as a whole and consider several aspects of user experience. This work will focus on developing and improving the thermoplastic polyurethane (TPU) lamination integration method for e-textiles. In the work, a stretchable copper-polyimide based circuit was laminated onto knit fabric using various TPU films and stacks. The study shares measurable characteristics to determine which material assembly and design would ensure the highest durability for the electronics part without losing its original textile softness, flexibility and stretchability.https://www.mdpi.com/1424-8220/22/1/156e-textilesstretchable electronicswearablespackagingwashing reliability |
| spellingShingle | Paula Veske Frederick Bossuyt Jan Vanfleteren Testing for Wearability and Reliability of TPU Lamination Method in E-Textiles Sensors e-textiles stretchable electronics wearables packaging washing reliability |
| title | Testing for Wearability and Reliability of TPU Lamination Method in E-Textiles |
| title_full | Testing for Wearability and Reliability of TPU Lamination Method in E-Textiles |
| title_fullStr | Testing for Wearability and Reliability of TPU Lamination Method in E-Textiles |
| title_full_unstemmed | Testing for Wearability and Reliability of TPU Lamination Method in E-Textiles |
| title_short | Testing for Wearability and Reliability of TPU Lamination Method in E-Textiles |
| title_sort | testing for wearability and reliability of tpu lamination method in e textiles |
| topic | e-textiles stretchable electronics wearables packaging washing reliability |
| url | https://www.mdpi.com/1424-8220/22/1/156 |
| work_keys_str_mv | AT paulaveske testingforwearabilityandreliabilityoftpulaminationmethodinetextiles AT frederickbossuyt testingforwearabilityandreliabilityoftpulaminationmethodinetextiles AT janvanfleteren testingforwearabilityandreliabilityoftpulaminationmethodinetextiles |