Investigation of Compact Hollow-Anode Discharge Source for Copper Thin Films by Sputtering Processes

Investigation of Compact Hollow-Anode Discharge Source for Copper Thin Films by Sputtering Processes

A compact hollow-anode discharge (HAD) source with a size of 60 mm in radius and 70 mm in length has been developed to stably generate plasma jets for various sputtering processes in semiconductor and display fabrications. A developed HAD plasma source has been investigated by cylindrical electric p...

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Bibliographic Details
Main Authors: In-Je Kang, Ji-Hun Kim, In-Sun Park, Kyu-Sun Chung
Format: Article
Language:English
Published: MDPI AG 2021-05-01
Series:Energies
Subjects:
hollow anode discharge source
uniform density discharge model
copper thin films
Online Access:https://www.mdpi.com/1996-1073/14/11/3138

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