Anti-friction gold-based stretchable electronics enabled by interfacial diffusion-induced cohesion
Abstract Stretchable electronics that prevalently adopt chemically inert metals as sensing layers and interconnect wires have enabled high-fidelity signal acquisition for on-skin applications. However, the weak interfacial interaction between inert metals and elastomers limit the tolerance of the de...
| Main Authors: | , , , , , , , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2024-02-01
|
| Series: | Nature Communications |
| Online Access: | https://doi.org/10.1038/s41467-024-45393-x |
| _version_ | 1797273938750865408 |
|---|---|
| author | Jie Cao Xusheng Liu Jie Qiu Zhifei Yue Yang Li Qian Xu Yan Chen Jiewen Chen Hongfei Cheng Guozhong Xing Enming Song Ming Wang Qi Liu Ming Liu |
| author_facet | Jie Cao Xusheng Liu Jie Qiu Zhifei Yue Yang Li Qian Xu Yan Chen Jiewen Chen Hongfei Cheng Guozhong Xing Enming Song Ming Wang Qi Liu Ming Liu |
| author_sort | Jie Cao |
| collection | DOAJ |
| description | Abstract Stretchable electronics that prevalently adopt chemically inert metals as sensing layers and interconnect wires have enabled high-fidelity signal acquisition for on-skin applications. However, the weak interfacial interaction between inert metals and elastomers limit the tolerance of the device to external friction interferences. Here, we report an interfacial diffusion-induced cohesion strategy that utilizes hydrophilic polyurethane to wet gold (Au) grains and render them wrapped by strong hydrogen bonding, resulting in a high interfacial binding strength of 1017.6 N/m. By further constructing a nanoscale rough configuration of the polyurethane (RPU), the binding strength of Au-RPU device increases to 1243.4 N/m, which is 100 and 4 times higher than that of conventional polydimethylsiloxane and styrene-ethylene-butylene-styrene-based devices, respectively. The stretchable Au-RPU device can remain good electrical conductivity after 1022 frictions at 130 kPa pressure, and reliably record high-fidelity electrophysiological signals. Furthermore, an anti-friction pressure sensor array is constructed based on Au-RPU interconnect wires, demonstrating a superior mechanical durability for concentrated large pressure acquisition. This chemical modification-free approach of interfacial strengthening for chemically inert metal-based stretchable electronics is promising for three-dimensional integration and on-chip interconnection. |
| first_indexed | 2024-03-07T14:51:16Z |
| format | Article |
| id | doaj.art-2e765ace6144476fb4f64053ab39af61 |
| institution | Directory Open Access Journal |
| issn | 2041-1723 |
| language | English |
| last_indexed | 2024-03-07T14:51:16Z |
| publishDate | 2024-02-01 |
| publisher | Nature Portfolio |
| record_format | Article |
| series | Nature Communications |
| spelling | doaj.art-2e765ace6144476fb4f64053ab39af612024-03-05T19:40:29ZengNature PortfolioNature Communications2041-17232024-02-0115111110.1038/s41467-024-45393-xAnti-friction gold-based stretchable electronics enabled by interfacial diffusion-induced cohesionJie Cao0Xusheng Liu1Jie Qiu2Zhifei Yue3Yang Li4Qian Xu5Yan Chen6Jiewen Chen7Hongfei Cheng8Guozhong Xing9Enming Song10Ming Wang11Qi Liu12Ming Liu13Frontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan UniversityFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan UniversityFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan UniversityFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan UniversityFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan UniversityFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan UniversityFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan UniversityFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan UniversitySchool of Materials Science and Engineering, Tongji UniversityKey Laboratory of Microelectronic Devices & Integrated Technology, Institute of Microelectronics, University of the Chinese Academy of Sciences, Chinese Academy of SciencesShanghai Frontiers Science Research Base of Intelligent Optoelectronics and Perception, Institute of Optoelectronics, State Key Laboratory of Integrated Chips and Systems, Fudan UniversityFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan UniversityFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan UniversityFrontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan UniversityAbstract Stretchable electronics that prevalently adopt chemically inert metals as sensing layers and interconnect wires have enabled high-fidelity signal acquisition for on-skin applications. However, the weak interfacial interaction between inert metals and elastomers limit the tolerance of the device to external friction interferences. Here, we report an interfacial diffusion-induced cohesion strategy that utilizes hydrophilic polyurethane to wet gold (Au) grains and render them wrapped by strong hydrogen bonding, resulting in a high interfacial binding strength of 1017.6 N/m. By further constructing a nanoscale rough configuration of the polyurethane (RPU), the binding strength of Au-RPU device increases to 1243.4 N/m, which is 100 and 4 times higher than that of conventional polydimethylsiloxane and styrene-ethylene-butylene-styrene-based devices, respectively. The stretchable Au-RPU device can remain good electrical conductivity after 1022 frictions at 130 kPa pressure, and reliably record high-fidelity electrophysiological signals. Furthermore, an anti-friction pressure sensor array is constructed based on Au-RPU interconnect wires, demonstrating a superior mechanical durability for concentrated large pressure acquisition. This chemical modification-free approach of interfacial strengthening for chemically inert metal-based stretchable electronics is promising for three-dimensional integration and on-chip interconnection.https://doi.org/10.1038/s41467-024-45393-x |
| spellingShingle | Jie Cao Xusheng Liu Jie Qiu Zhifei Yue Yang Li Qian Xu Yan Chen Jiewen Chen Hongfei Cheng Guozhong Xing Enming Song Ming Wang Qi Liu Ming Liu Anti-friction gold-based stretchable electronics enabled by interfacial diffusion-induced cohesion Nature Communications |
| title | Anti-friction gold-based stretchable electronics enabled by interfacial diffusion-induced cohesion |
| title_full | Anti-friction gold-based stretchable electronics enabled by interfacial diffusion-induced cohesion |
| title_fullStr | Anti-friction gold-based stretchable electronics enabled by interfacial diffusion-induced cohesion |
| title_full_unstemmed | Anti-friction gold-based stretchable electronics enabled by interfacial diffusion-induced cohesion |
| title_short | Anti-friction gold-based stretchable electronics enabled by interfacial diffusion-induced cohesion |
| title_sort | anti friction gold based stretchable electronics enabled by interfacial diffusion induced cohesion |
| url | https://doi.org/10.1038/s41467-024-45393-x |
| work_keys_str_mv | AT jiecao antifrictiongoldbasedstretchableelectronicsenabledbyinterfacialdiffusioninducedcohesion AT xushengliu antifrictiongoldbasedstretchableelectronicsenabledbyinterfacialdiffusioninducedcohesion AT jieqiu antifrictiongoldbasedstretchableelectronicsenabledbyinterfacialdiffusioninducedcohesion AT zhifeiyue antifrictiongoldbasedstretchableelectronicsenabledbyinterfacialdiffusioninducedcohesion AT yangli antifrictiongoldbasedstretchableelectronicsenabledbyinterfacialdiffusioninducedcohesion AT qianxu antifrictiongoldbasedstretchableelectronicsenabledbyinterfacialdiffusioninducedcohesion AT yanchen antifrictiongoldbasedstretchableelectronicsenabledbyinterfacialdiffusioninducedcohesion AT jiewenchen antifrictiongoldbasedstretchableelectronicsenabledbyinterfacialdiffusioninducedcohesion AT hongfeicheng antifrictiongoldbasedstretchableelectronicsenabledbyinterfacialdiffusioninducedcohesion AT guozhongxing antifrictiongoldbasedstretchableelectronicsenabledbyinterfacialdiffusioninducedcohesion AT enmingsong antifrictiongoldbasedstretchableelectronicsenabledbyinterfacialdiffusioninducedcohesion AT mingwang antifrictiongoldbasedstretchableelectronicsenabledbyinterfacialdiffusioninducedcohesion AT qiliu antifrictiongoldbasedstretchableelectronicsenabledbyinterfacialdiffusioninducedcohesion AT mingliu antifrictiongoldbasedstretchableelectronicsenabledbyinterfacialdiffusioninducedcohesion |