Simulation of temperature conditions in the elements of microelectronic devices
The heat equation with discontinuous and singular coefficients for isotropic band with foreign rectangular inclusion has been built with the use of generalized functions based method. Using the of integral transformftions the analytical solution of this equation has been obtained in case when on one...
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| Format: | Article |
| Language: | English |
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Politehperiodika
2011-04-01
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| Series: | Tekhnologiya i Konstruirovanie v Elektronnoi Apparature |
| Subjects: | |
| Online Access: | http://www.tkea.com.ua/tkea/2011/1-2_2011/pdf/09.zip |
| _version_ | 1819133007483633664 |
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| author | Gavrysh V. I. Kosach A. I. |
| author_facet | Gavrysh V. I. Kosach A. I. |
| author_sort | Gavrysh V. I. |
| collection | DOAJ |
| description | The heat equation with discontinuous and singular coefficients for isotropic band with foreign rectangular inclusion has been built with the use of generalized functions based method. Using the of integral transformftions the analytical solution of this equation has been obtained in case when on one of the band bounds the convective heat transfer with the environment takes place, but the other is under the heat flow. The piecewise-linear approximation of the required temperature at the boundaries of foreign inclusions using generalized functions has been conducted. |
| first_indexed | 2024-12-22T09:40:27Z |
| format | Article |
| id | doaj.art-2e7a7cd40a5944599529d74434737c41 |
| institution | Directory Open Access Journal |
| issn | 2225-5818 |
| language | English |
| last_indexed | 2024-12-22T09:40:27Z |
| publishDate | 2011-04-01 |
| publisher | Politehperiodika |
| record_format | Article |
| series | Tekhnologiya i Konstruirovanie v Elektronnoi Apparature |
| spelling | doaj.art-2e7a7cd40a5944599529d74434737c412022-12-21T18:30:43ZengPolitehperiodikaTekhnologiya i Konstruirovanie v Elektronnoi Apparature2225-58182011-04-011-22730Simulation of temperature conditions in the elements of microelectronic devicesGavrysh V. I.Kosach A. I.The heat equation with discontinuous and singular coefficients for isotropic band with foreign rectangular inclusion has been built with the use of generalized functions based method. Using the of integral transformftions the analytical solution of this equation has been obtained in case when on one of the band bounds the convective heat transfer with the environment takes place, but the other is under the heat flow. The piecewise-linear approximation of the required temperature at the boundaries of foreign inclusions using generalized functions has been conducted.http://www.tkea.com.ua/tkea/2011/1-2_2011/pdf/09.zipisotropic bandforeign inclusionsheat flowperfect thermal contactheat transferconvective heat transferthermal conductivityexcess temperature |
| spellingShingle | Gavrysh V. I. Kosach A. I. Simulation of temperature conditions in the elements of microelectronic devices Tekhnologiya i Konstruirovanie v Elektronnoi Apparature isotropic band foreign inclusions heat flow perfect thermal contact heat transfer convective heat transfer thermal conductivity excess temperature |
| title | Simulation of temperature conditions in the elements of microelectronic devices |
| title_full | Simulation of temperature conditions in the elements of microelectronic devices |
| title_fullStr | Simulation of temperature conditions in the elements of microelectronic devices |
| title_full_unstemmed | Simulation of temperature conditions in the elements of microelectronic devices |
| title_short | Simulation of temperature conditions in the elements of microelectronic devices |
| title_sort | simulation of temperature conditions in the elements of microelectronic devices |
| topic | isotropic band foreign inclusions heat flow perfect thermal contact heat transfer convective heat transfer thermal conductivity excess temperature |
| url | http://www.tkea.com.ua/tkea/2011/1-2_2011/pdf/09.zip |
| work_keys_str_mv | AT gavryshvi simulationoftemperatureconditionsintheelementsofmicroelectronicdevices AT kosachai simulationoftemperatureconditionsintheelementsofmicroelectronicdevices |