Photoreduction of Copper Ions Using Silica–Surfactant Hybrid and Titanium (IV) Oxide under Sulfuric Acid Conditions

Photoreduction of Cu<sup>2+</sup> ions to Cu metal by titanium(IV) oxide (TiO<sub>2</sub>) was conducted in the presence of a silica–surfactant hybrid under sulfuric acid conditions. After irradiation, a dark-red color, reflections due to Cu metal in the X-ray diffraction pat...

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Main Authors: Shingo Machida, Reo Kato, Kaishi Hasegawa, Takahiro Gotoh, Ken-ichi Katsumata, Atsuo Yasumori
Format: Article
Language:English
Published: MDPI AG 2022-07-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/15/15/5132
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author Shingo Machida
Reo Kato
Kaishi Hasegawa
Takahiro Gotoh
Ken-ichi Katsumata
Atsuo Yasumori
author_facet Shingo Machida
Reo Kato
Kaishi Hasegawa
Takahiro Gotoh
Ken-ichi Katsumata
Atsuo Yasumori
author_sort Shingo Machida
collection DOAJ
description Photoreduction of Cu<sup>2+</sup> ions to Cu metal by titanium(IV) oxide (TiO<sub>2</sub>) was conducted in the presence of a silica–surfactant hybrid under sulfuric acid conditions. After irradiation, a dark-red color, reflections due to Cu metal in the X-ray diffraction pattern, and peaks due to Cu 2<i>p</i><sub>1/2</sub> and 2<i>p</i><sub>3/2</sub> in the X-ray photoelectron spectrum indicated the precipitation of Cu metal in the product. In addition, an increase in the Brunauer–Emmett–Teller specific surface area from 36 and 45 m<sup>2</sup>/g for the silica–surfactant and TiO<sub>2</sub>, respectively, to 591 m<sup>2</sup>/g for the product, and a decrease in the intensity of the C-H stretching band in the Fourier–transform infra-red spectra implied the removal of surfactant during the reaction. These characteristics were never observed when TiO<sub>2</sub> was used solely. Therefore, this study indicated that the photoreduction of Cu<sup>2+</sup> ions to Cu metal by TiO<sub>2</sub> was facilitated under the sulfuric acid medium, where the surfactants extracted from silica–surfactant hybrids by protons in the acidic condition were successfully photo-oxidized by TiO<sub>2</sub>. Thus, this study presents a new application of the conversion of a silica–surfactant hybrid into mesoporous silicas.
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spelling doaj.art-2f23a4f672e64328a2718b927707be872023-11-30T22:34:58ZengMDPI AGMaterials1996-19442022-07-011515513210.3390/ma15155132Photoreduction of Copper Ions Using Silica–Surfactant Hybrid and Titanium (IV) Oxide under Sulfuric Acid ConditionsShingo Machida0Reo Kato1Kaishi Hasegawa2Takahiro Gotoh3Ken-ichi Katsumata4Atsuo Yasumori5Department of Material Science and Technology, Faculty of Advanced Engineering, Tokyo University of Science, 6-3-1 Niijuku, Katsushika-ku, Tokyo 125-8585, JapanDepartment of Material Science and Technology, Faculty of Advanced Engineering, Tokyo University of Science, 6-3-1 Niijuku, Katsushika-ku, Tokyo 125-8585, JapanDepartment of Material Science and Technology, Faculty of Advanced Engineering, Tokyo University of Science, 6-3-1 Niijuku, Katsushika-ku, Tokyo 125-8585, JapanMaterial Characterization Central Laboratory, School of Science and Engineering, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo 169-8555, JapanDepartment of Material Science and Technology, Faculty of Advanced Engineering, Tokyo University of Science, 6-3-1 Niijuku, Katsushika-ku, Tokyo 125-8585, JapanDepartment of Material Science and Technology, Faculty of Advanced Engineering, Tokyo University of Science, 6-3-1 Niijuku, Katsushika-ku, Tokyo 125-8585, JapanPhotoreduction of Cu<sup>2+</sup> ions to Cu metal by titanium(IV) oxide (TiO<sub>2</sub>) was conducted in the presence of a silica–surfactant hybrid under sulfuric acid conditions. After irradiation, a dark-red color, reflections due to Cu metal in the X-ray diffraction pattern, and peaks due to Cu 2<i>p</i><sub>1/2</sub> and 2<i>p</i><sub>3/2</sub> in the X-ray photoelectron spectrum indicated the precipitation of Cu metal in the product. In addition, an increase in the Brunauer–Emmett–Teller specific surface area from 36 and 45 m<sup>2</sup>/g for the silica–surfactant and TiO<sub>2</sub>, respectively, to 591 m<sup>2</sup>/g for the product, and a decrease in the intensity of the C-H stretching band in the Fourier–transform infra-red spectra implied the removal of surfactant during the reaction. These characteristics were never observed when TiO<sub>2</sub> was used solely. Therefore, this study indicated that the photoreduction of Cu<sup>2+</sup> ions to Cu metal by TiO<sub>2</sub> was facilitated under the sulfuric acid medium, where the surfactants extracted from silica–surfactant hybrids by protons in the acidic condition were successfully photo-oxidized by TiO<sub>2</sub>. Thus, this study presents a new application of the conversion of a silica–surfactant hybrid into mesoporous silicas.https://www.mdpi.com/1996-1944/15/15/5132mesoporous silicasilica–surfactant hybridheavy metal ionphotoreductiontitanium oxide
spellingShingle Shingo Machida
Reo Kato
Kaishi Hasegawa
Takahiro Gotoh
Ken-ichi Katsumata
Atsuo Yasumori
Photoreduction of Copper Ions Using Silica–Surfactant Hybrid and Titanium (IV) Oxide under Sulfuric Acid Conditions
Materials
mesoporous silica
silica–surfactant hybrid
heavy metal ion
photoreduction
titanium oxide
title Photoreduction of Copper Ions Using Silica–Surfactant Hybrid and Titanium (IV) Oxide under Sulfuric Acid Conditions
title_full Photoreduction of Copper Ions Using Silica–Surfactant Hybrid and Titanium (IV) Oxide under Sulfuric Acid Conditions
title_fullStr Photoreduction of Copper Ions Using Silica–Surfactant Hybrid and Titanium (IV) Oxide under Sulfuric Acid Conditions
title_full_unstemmed Photoreduction of Copper Ions Using Silica–Surfactant Hybrid and Titanium (IV) Oxide under Sulfuric Acid Conditions
title_short Photoreduction of Copper Ions Using Silica–Surfactant Hybrid and Titanium (IV) Oxide under Sulfuric Acid Conditions
title_sort photoreduction of copper ions using silica surfactant hybrid and titanium iv oxide under sulfuric acid conditions
topic mesoporous silica
silica–surfactant hybrid
heavy metal ion
photoreduction
titanium oxide
url https://www.mdpi.com/1996-1944/15/15/5132
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