Optimizing ultra-wideband balanced power amplifiers through the selection of different output impedance transformation based on SiP techniques
In this paper, two improved ultra-wideband (UWB) balanced power amplifiers based on the flip-chip system-in-package technique and electronic design automation (EDA) are proposed. The conventional approach to system-on-chip (SoC) involves integrating all sub-circuit designs into a single manufacturin...
| Autors principals: | , , , |
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| Format: | Article |
| Idioma: | English |
| Publicat: |
AIP Publishing LLC
2024-02-01
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| Col·lecció: | AIP Advances |
| Accés en línia: | http://dx.doi.org/10.1063/5.0194091 |