Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates
Emerging trends like the Internet of Things require an increasing number of different sensors, actuators and electronic devices. To enable new applications, such as wearables and electronic skins, flexible sensor technologies are required. However, established technologies for the fabrication of sen...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-02-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/14/2/415 |
| _version_ | 1827756347120156672 |
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| author | Franz Selbmann Soumya Deep Paul Maulik Satwara Frank Roscher Maik Wiemer Harald Kuhn Yvonne Joseph |
| author_facet | Franz Selbmann Soumya Deep Paul Maulik Satwara Frank Roscher Maik Wiemer Harald Kuhn Yvonne Joseph |
| author_sort | Franz Selbmann |
| collection | DOAJ |
| description | Emerging trends like the Internet of Things require an increasing number of different sensors, actuators and electronic devices. To enable new applications, such as wearables and electronic skins, flexible sensor technologies are required. However, established technologies for the fabrication of sensors and actuators, as well as the related packaging, are based on rigid substrates, i.e., silicon wafer substrates and printed circuit boards (PCB). Moreover, most of the flexible substrates investigated until now are not compatible with the aforementioned fabrication technologies on wafers due to their lack of chemical inertness and handling issues. In this presented paper, we demonstrate a conceptually new approach to transfer structures, dies, and electronic components to a flexible substrate by lift-off. The structures to be transferred, including the related electrical contacts and packaging, are fabricated on a rigid carrier substrate, coated with the flexible substrate and finally lifted off from the carrier. The benefits of this approach are the combined advantages of using established semiconductor and microsystem fabrication technologies as well as packaging technologies, such as high precision and miniaturization, as well as a variety of available materials and processes together with those of flexible substrates, such as a geometry adaptivity, lightweight structures and low costs. |
| first_indexed | 2024-03-11T08:23:55Z |
| format | Article |
| id | doaj.art-32141b3d74cc4ba78886bb6ad997d9c9 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-11T08:23:55Z |
| publishDate | 2023-02-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-32141b3d74cc4ba78886bb6ad997d9c92023-11-16T22:11:55ZengMDPI AGMicromachines2072-666X2023-02-0114241510.3390/mi14020415Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible SubstratesFranz Selbmann0Soumya Deep Paul1Maulik Satwara2Frank Roscher3Maik Wiemer4Harald Kuhn5Yvonne Joseph6Fraunhofer Institute for Electronic Nano Systems ENAS, 09126 Chemnitz, GermanyFraunhofer Institute for Electronic Nano Systems ENAS, 09126 Chemnitz, GermanyFraunhofer Institute for Electronic Nano Systems ENAS, 09126 Chemnitz, GermanyFraunhofer Institute for Electronic Nano Systems ENAS, 09126 Chemnitz, GermanyFraunhofer Institute for Electronic Nano Systems ENAS, 09126 Chemnitz, GermanyFraunhofer Institute for Electronic Nano Systems ENAS, 09126 Chemnitz, GermanyTU Bergakademie Freiberg, Institute for Electronic and Sensor Materials, 09599 Freiberg, GermanyEmerging trends like the Internet of Things require an increasing number of different sensors, actuators and electronic devices. To enable new applications, such as wearables and electronic skins, flexible sensor technologies are required. However, established technologies for the fabrication of sensors and actuators, as well as the related packaging, are based on rigid substrates, i.e., silicon wafer substrates and printed circuit boards (PCB). Moreover, most of the flexible substrates investigated until now are not compatible with the aforementioned fabrication technologies on wafers due to their lack of chemical inertness and handling issues. In this presented paper, we demonstrate a conceptually new approach to transfer structures, dies, and electronic components to a flexible substrate by lift-off. The structures to be transferred, including the related electrical contacts and packaging, are fabricated on a rigid carrier substrate, coated with the flexible substrate and finally lifted off from the carrier. The benefits of this approach are the combined advantages of using established semiconductor and microsystem fabrication technologies as well as packaging technologies, such as high precision and miniaturization, as well as a variety of available materials and processes together with those of flexible substrates, such as a geometry adaptivity, lightweight structures and low costs.https://www.mdpi.com/2072-666X/14/2/415chip scale packagingelectronics packagingflexible electronicsintegration technologiesmetallizationParylene |
| spellingShingle | Franz Selbmann Soumya Deep Paul Maulik Satwara Frank Roscher Maik Wiemer Harald Kuhn Yvonne Joseph Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates Micromachines chip scale packaging electronics packaging flexible electronics integration technologies metallization Parylene |
| title | Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates |
| title_full | Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates |
| title_fullStr | Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates |
| title_full_unstemmed | Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates |
| title_short | Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates |
| title_sort | paradigm changing integration technology for the production of flexible electronics by transferring structures dies and electrical components from rigid to flexible substrates |
| topic | chip scale packaging electronics packaging flexible electronics integration technologies metallization Parylene |
| url | https://www.mdpi.com/2072-666X/14/2/415 |
| work_keys_str_mv | AT franzselbmann paradigmchangingintegrationtechnologyfortheproductionofflexibleelectronicsbytransferringstructuresdiesandelectricalcomponentsfromrigidtoflexiblesubstrates AT soumyadeeppaul paradigmchangingintegrationtechnologyfortheproductionofflexibleelectronicsbytransferringstructuresdiesandelectricalcomponentsfromrigidtoflexiblesubstrates AT mauliksatwara paradigmchangingintegrationtechnologyfortheproductionofflexibleelectronicsbytransferringstructuresdiesandelectricalcomponentsfromrigidtoflexiblesubstrates AT frankroscher paradigmchangingintegrationtechnologyfortheproductionofflexibleelectronicsbytransferringstructuresdiesandelectricalcomponentsfromrigidtoflexiblesubstrates AT maikwiemer paradigmchangingintegrationtechnologyfortheproductionofflexibleelectronicsbytransferringstructuresdiesandelectricalcomponentsfromrigidtoflexiblesubstrates AT haraldkuhn paradigmchangingintegrationtechnologyfortheproductionofflexibleelectronicsbytransferringstructuresdiesandelectricalcomponentsfromrigidtoflexiblesubstrates AT yvonnejoseph paradigmchangingintegrationtechnologyfortheproductionofflexibleelectronicsbytransferringstructuresdiesandelectricalcomponentsfromrigidtoflexiblesubstrates |