Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip
A microstructure-based model is proposed for quantitative estimation of tensile mechanical property of Cu/Al clad strips. In the proposed model, the fracture criterion for matrix Cu and Al, interface intermetallic compounds (IMCs) and interface between matrix and IMCs are established and incorporate...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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IOP Publishing
2020-01-01
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| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/ab6c0a |
| _version_ | 1797746931080888320 |
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| author | Tao Sun Hong-wu Song Fu-an Hua Jian-ping Li |
| author_facet | Tao Sun Hong-wu Song Fu-an Hua Jian-ping Li |
| author_sort | Tao Sun |
| collection | DOAJ |
| description | A microstructure-based model is proposed for quantitative estimation of tensile mechanical property of Cu/Al clad strips. In the proposed model, the fracture criterion for matrix Cu and Al, interface intermetallic compounds (IMCs) and interface between matrix and IMCs are established and incorporated. The effect of IMCs thickness and strip thickness on tensile behavior of Cu/Al strip was studied quantitatively using the proposed model. And a new dimensionless parameter w/t is also proposed to be a control index for tensile mechanical property of Cu/Al clad strips. And a critical value of w/t which is defined to be 0.025 in this study is found to be important in controlling mechanical property of Cu/Al strip with a thickness less than 0.5 mm. The potential application of the proposed model and parameter is also discussed for annealing process optimization and mechanical property control of 0.12 mm thick Cu/Al clad strips. |
| first_indexed | 2024-03-12T15:44:52Z |
| format | Article |
| id | doaj.art-34c715b76e124146bc9247eb325e92ee |
| institution | Directory Open Access Journal |
| issn | 2053-1591 |
| language | English |
| last_indexed | 2024-03-12T15:44:52Z |
| publishDate | 2020-01-01 |
| publisher | IOP Publishing |
| record_format | Article |
| series | Materials Research Express |
| spelling | doaj.art-34c715b76e124146bc9247eb325e92ee2023-08-09T15:31:16ZengIOP PublishingMaterials Research Express2053-15912020-01-017101658910.1088/2053-1591/ab6c0aMicrostructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad stripTao Sun0Hong-wu Song1https://orcid.org/0000-0003-4872-6807Fu-an Hua2Jian-ping Li3The State Key Laboratory of Rolling and Automation, Northeastern University , Shenyang 110819, People’s Republic of ChinaInstitute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of ChinaThe State Key Laboratory of Rolling and Automation, Northeastern University , Shenyang 110819, People’s Republic of ChinaThe State Key Laboratory of Rolling and Automation, Northeastern University , Shenyang 110819, People’s Republic of ChinaA microstructure-based model is proposed for quantitative estimation of tensile mechanical property of Cu/Al clad strips. In the proposed model, the fracture criterion for matrix Cu and Al, interface intermetallic compounds (IMCs) and interface between matrix and IMCs are established and incorporated. The effect of IMCs thickness and strip thickness on tensile behavior of Cu/Al strip was studied quantitatively using the proposed model. And a new dimensionless parameter w/t is also proposed to be a control index for tensile mechanical property of Cu/Al clad strips. And a critical value of w/t which is defined to be 0.025 in this study is found to be important in controlling mechanical property of Cu/Al strip with a thickness less than 0.5 mm. The potential application of the proposed model and parameter is also discussed for annealing process optimization and mechanical property control of 0.12 mm thick Cu/Al clad strips.https://doi.org/10.1088/2053-1591/ab6c0aclad stripcold roll bondingintermetallic compoundtensile propertymicrostructure-based modeling |
| spellingShingle | Tao Sun Hong-wu Song Fu-an Hua Jian-ping Li Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip Materials Research Express clad strip cold roll bonding intermetallic compound tensile property microstructure-based modeling |
| title | Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip |
| title_full | Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip |
| title_fullStr | Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip |
| title_full_unstemmed | Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip |
| title_short | Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip |
| title_sort | microstructure based modeling of imc layer thickness effect on tensile behavior of cu al clad strip |
| topic | clad strip cold roll bonding intermetallic compound tensile property microstructure-based modeling |
| url | https://doi.org/10.1088/2053-1591/ab6c0a |
| work_keys_str_mv | AT taosun microstructurebasedmodelingofimclayerthicknesseffectontensilebehaviorofcualcladstrip AT hongwusong microstructurebasedmodelingofimclayerthicknesseffectontensilebehaviorofcualcladstrip AT fuanhua microstructurebasedmodelingofimclayerthicknesseffectontensilebehaviorofcualcladstrip AT jianpingli microstructurebasedmodelingofimclayerthicknesseffectontensilebehaviorofcualcladstrip |