Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip
A microstructure-based model is proposed for quantitative estimation of tensile mechanical property of Cu/Al clad strips. In the proposed model, the fracture criterion for matrix Cu and Al, interface intermetallic compounds (IMCs) and interface between matrix and IMCs are established and incorporate...
Main Authors: | Tao Sun, Hong-wu Song, Fu-an Hua, Jian-ping Li |
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Format: | Article |
Language: | English |
Published: |
IOP Publishing
2020-01-01
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Series: | Materials Research Express |
Subjects: | |
Online Access: | https://doi.org/10.1088/2053-1591/ab6c0a |
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