Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry
We compare ultrasonic welding (UW) and thermal bonding (TB) for the integration of embedded thin-film gold electrodes for electrochemical applications in injection molded (IM) microfluidic chips. The UW bonded chips showed a significantly superior electrochemical performance compared to the ones obt...
Main Authors: | Marco Matteucci, Arto Heiskanen, Kinga Zór, Jenny Emnéus, Rafael Taboryski |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2016-10-01
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Series: | Sensors |
Subjects: | |
Online Access: | http://www.mdpi.com/1424-8220/16/11/1795 |
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