Thermal Stability of Commercially Pure Ti Processed by 135°ECAP and Swaging
Commercially pure(CP) Ti fabricated by 135° ECAP and swaging was annealed at 100, 150, 200, 250, 300, 350, 400, 450℃ and 500℃ for 1h, respectively. The microstructure and properties of annealed commercially pure Ti were investigated by transmission electron microscopy, scanning electron mic...
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Format: | Article |
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Journal of Materials Engineering
2017-06-01
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Series: | Cailiao gongcheng |
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Online Access: | http://jme.biam.ac.cn/CN/Y2017/V45/I6/49 |
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author | SONG Xiao-jie YANG Xi-rong LIU Xiao-yan ZHAO Xi-cheng LUO Lei |
author_facet | SONG Xiao-jie YANG Xi-rong LIU Xiao-yan ZHAO Xi-cheng LUO Lei |
author_sort | SONG Xiao-jie |
collection | DOAJ |
description | Commercially pure(CP) Ti fabricated by 135° ECAP and swaging was annealed at 100, 150, 200, 250, 300, 350, 400, 450℃ and 500℃ for 1h, respectively. The microstructure and properties of annealed commercially pure Ti were investigated by transmission electron microscopy, scanning electron microscopy, uniaxial tensile test and microhardness test. The results show that when annealing temperature is below 400℃, dislocation density reduces gradually and grain boundary becomes clear, no obvious change occurs in the microstructure,ultimate tensile strength and microhardness decrease slightly and no obvious increase occurs in the elongation;when annealing temperature is above 400℃, recrystallization occurs with the increase of annealing temperature, and the grain size increases obviously, the average size is about 5<i>μ</i>m, the ultimate tensile strength and microhardness decrease significantly and elongation increases at the same time. The tensile fracture shows the tensile fracture of annealed commercial pure Ti by ECAP and swaging is ductile fracture. With the increase of annealing temperature, the size and depth of dimples increase. |
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id | doaj.art-359ec746961840c3873573f82dd7ac5e |
institution | Directory Open Access Journal |
issn | 1001-4381 1001-4381 |
language | zho |
last_indexed | 2024-04-11T02:12:37Z |
publishDate | 2017-06-01 |
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series | Cailiao gongcheng |
spelling | doaj.art-359ec746961840c3873573f82dd7ac5e2023-01-03T01:48:58ZzhoJournal of Materials EngineeringCailiao gongcheng1001-43811001-43812017-06-01456495410.11868/j.issn.1001-4381.2015.000872201706000872Thermal Stability of Commercially Pure Ti Processed by 135°ECAP and SwagingSONG Xiao-jie0YANG Xi-rong1LIU Xiao-yan2ZHAO Xi-cheng3LUO Lei4College of Metallurgical Engineering, Xi'an University of Architecture and Technology, Xi'an 710055, ChinaCollege of Metallurgical Engineering, Xi'an University of Architecture and Technology, Xi'an 710055, ChinaCollege of Metallurgical Engineering, Xi'an University of Architecture and Technology, Xi'an 710055, ChinaCollege of Metallurgical Engineering, Xi'an University of Architecture and Technology, Xi'an 710055, ChinaCollege of Metallurgical Engineering, Xi'an University of Architecture and Technology, Xi'an 710055, ChinaCommercially pure(CP) Ti fabricated by 135° ECAP and swaging was annealed at 100, 150, 200, 250, 300, 350, 400, 450℃ and 500℃ for 1h, respectively. The microstructure and properties of annealed commercially pure Ti were investigated by transmission electron microscopy, scanning electron microscopy, uniaxial tensile test and microhardness test. The results show that when annealing temperature is below 400℃, dislocation density reduces gradually and grain boundary becomes clear, no obvious change occurs in the microstructure,ultimate tensile strength and microhardness decrease slightly and no obvious increase occurs in the elongation;when annealing temperature is above 400℃, recrystallization occurs with the increase of annealing temperature, and the grain size increases obviously, the average size is about 5<i>μ</i>m, the ultimate tensile strength and microhardness decrease significantly and elongation increases at the same time. The tensile fracture shows the tensile fracture of annealed commercial pure Ti by ECAP and swaging is ductile fracture. With the increase of annealing temperature, the size and depth of dimples increase.http://jme.biam.ac.cn/CN/Y2017/V45/I6/49equal channel angular pressingswagingCP-Tiannealing |
spellingShingle | SONG Xiao-jie YANG Xi-rong LIU Xiao-yan ZHAO Xi-cheng LUO Lei Thermal Stability of Commercially Pure Ti Processed by 135°ECAP and Swaging Cailiao gongcheng equal channel angular pressing swaging CP-Ti annealing |
title | Thermal Stability of Commercially Pure Ti Processed by 135°ECAP and Swaging |
title_full | Thermal Stability of Commercially Pure Ti Processed by 135°ECAP and Swaging |
title_fullStr | Thermal Stability of Commercially Pure Ti Processed by 135°ECAP and Swaging |
title_full_unstemmed | Thermal Stability of Commercially Pure Ti Processed by 135°ECAP and Swaging |
title_short | Thermal Stability of Commercially Pure Ti Processed by 135°ECAP and Swaging |
title_sort | thermal stability of commercially pure ti processed by 135 176 ecap and swaging |
topic | equal channel angular pressing swaging CP-Ti annealing |
url | http://jme.biam.ac.cn/CN/Y2017/V45/I6/49 |
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