Thermal Stability of Commercially Pure Ti Processed by 135°ECAP and Swaging

Commercially pure(CP) Ti fabricated by 135° ECAP and swaging was annealed at 100, 150, 200, 250, 300, 350, 400, 450℃ and 500℃ for 1h, respectively. The microstructure and properties of annealed commercially pure Ti were investigated by transmission electron microscopy, scanning electron mic...

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Main Authors: SONG Xiao-jie, YANG Xi-rong, LIU Xiao-yan, ZHAO Xi-cheng, LUO Lei
Format: Article
Language:zho
Published: Journal of Materials Engineering 2017-06-01
Series:Cailiao gongcheng
Subjects:
Online Access:http://jme.biam.ac.cn/CN/Y2017/V45/I6/49
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author SONG Xiao-jie
YANG Xi-rong
LIU Xiao-yan
ZHAO Xi-cheng
LUO Lei
author_facet SONG Xiao-jie
YANG Xi-rong
LIU Xiao-yan
ZHAO Xi-cheng
LUO Lei
author_sort SONG Xiao-jie
collection DOAJ
description Commercially pure(CP) Ti fabricated by 135&#176; ECAP and swaging was annealed at 100, 150, 200, 250, 300, 350, 400, 450℃ and 500℃ for 1h, respectively. The microstructure and properties of annealed commercially pure Ti were investigated by transmission electron microscopy, scanning electron microscopy, uniaxial tensile test and microhardness test. The results show that when annealing temperature is below 400℃, dislocation density reduces gradually and grain boundary becomes clear, no obvious change occurs in the microstructure,ultimate tensile strength and microhardness decrease slightly and no obvious increase occurs in the elongation;when annealing temperature is above 400℃, recrystallization occurs with the increase of annealing temperature, and the grain size increases obviously, the average size is about 5<i>μ</i>m, the ultimate tensile strength and microhardness decrease significantly and elongation increases at the same time. The tensile fracture shows the tensile fracture of annealed commercial pure Ti by ECAP and swaging is ductile fracture. With the increase of annealing temperature, the size and depth of dimples increase.
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spelling doaj.art-359ec746961840c3873573f82dd7ac5e2023-01-03T01:48:58ZzhoJournal of Materials EngineeringCailiao gongcheng1001-43811001-43812017-06-01456495410.11868/j.issn.1001-4381.2015.000872201706000872Thermal Stability of Commercially Pure Ti Processed by 135&#176;ECAP and SwagingSONG Xiao-jie0YANG Xi-rong1LIU Xiao-yan2ZHAO Xi-cheng3LUO Lei4College of Metallurgical Engineering, Xi'an University of Architecture and Technology, Xi'an 710055, ChinaCollege of Metallurgical Engineering, Xi'an University of Architecture and Technology, Xi'an 710055, ChinaCollege of Metallurgical Engineering, Xi'an University of Architecture and Technology, Xi'an 710055, ChinaCollege of Metallurgical Engineering, Xi'an University of Architecture and Technology, Xi'an 710055, ChinaCollege of Metallurgical Engineering, Xi'an University of Architecture and Technology, Xi'an 710055, ChinaCommercially pure(CP) Ti fabricated by 135&#176; ECAP and swaging was annealed at 100, 150, 200, 250, 300, 350, 400, 450℃ and 500℃ for 1h, respectively. The microstructure and properties of annealed commercially pure Ti were investigated by transmission electron microscopy, scanning electron microscopy, uniaxial tensile test and microhardness test. The results show that when annealing temperature is below 400℃, dislocation density reduces gradually and grain boundary becomes clear, no obvious change occurs in the microstructure,ultimate tensile strength and microhardness decrease slightly and no obvious increase occurs in the elongation;when annealing temperature is above 400℃, recrystallization occurs with the increase of annealing temperature, and the grain size increases obviously, the average size is about 5<i>μ</i>m, the ultimate tensile strength and microhardness decrease significantly and elongation increases at the same time. The tensile fracture shows the tensile fracture of annealed commercial pure Ti by ECAP and swaging is ductile fracture. With the increase of annealing temperature, the size and depth of dimples increase.http://jme.biam.ac.cn/CN/Y2017/V45/I6/49equal channel angular pressingswagingCP-Tiannealing
spellingShingle SONG Xiao-jie
YANG Xi-rong
LIU Xiao-yan
ZHAO Xi-cheng
LUO Lei
Thermal Stability of Commercially Pure Ti Processed by 135&#176;ECAP and Swaging
Cailiao gongcheng
equal channel angular pressing
swaging
CP-Ti
annealing
title Thermal Stability of Commercially Pure Ti Processed by 135&#176;ECAP and Swaging
title_full Thermal Stability of Commercially Pure Ti Processed by 135&#176;ECAP and Swaging
title_fullStr Thermal Stability of Commercially Pure Ti Processed by 135&#176;ECAP and Swaging
title_full_unstemmed Thermal Stability of Commercially Pure Ti Processed by 135&#176;ECAP and Swaging
title_short Thermal Stability of Commercially Pure Ti Processed by 135&#176;ECAP and Swaging
title_sort thermal stability of commercially pure ti processed by 135 176 ecap and swaging
topic equal channel angular pressing
swaging
CP-Ti
annealing
url http://jme.biam.ac.cn/CN/Y2017/V45/I6/49
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AT yangxirong thermalstabilityofcommerciallypuretiprocessedby135176ecapandswaging
AT liuxiaoyan thermalstabilityofcommerciallypuretiprocessedby135176ecapandswaging
AT zhaoxicheng thermalstabilityofcommerciallypuretiprocessedby135176ecapandswaging
AT luolei thermalstabilityofcommerciallypuretiprocessedby135176ecapandswaging