Novel Thermal Analysis Model of the Foot-Shoe Sole Interface during Gait Motion
Excessive heat at the foot-shoe sole interface negatively affects a human’s thermal comfort. An understanding of the thermal behavior at this interface is important for alleviating this discomfort. During gait motion, a human’s body weight cyclically compresses a shoe sole (commonly constructed of v...
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| Format: | Article |
| Language: | English |
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MDPI AG
2018-02-01
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| Series: | Proceedings |
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| Online Access: | http://www.mdpi.com/2504-3900/2/6/278 |
| _version_ | 1827092460466077696 |
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| author | Yasuhiro Shimazaki Kazutoshi Aisaka |
| author_facet | Yasuhiro Shimazaki Kazutoshi Aisaka |
| author_sort | Yasuhiro Shimazaki |
| collection | DOAJ |
| description | Excessive heat at the foot-shoe sole interface negatively affects a human’s thermal comfort. An understanding of the thermal behavior at this interface is important for alleviating this discomfort. During gait motion, a human’s body weight cyclically compresses a shoe sole (commonly constructed of viscoelastic materials), generating heat during loading. To evaluate the thermal effects of this internal heat generation on foot comfort, we developed and empirically validated a thermal analysis model during gait motion. A simple, one-dimensional prediction model for heat conduction with heat generation during compressive loading was used. Heat generation was estimated as a function of the shoe sole’s material properties (e.g., elastic modulus) and various gait parameters. When compared with experimental results, the proposed model proved effective in predicting thermal behavior at the foot-shoe sole interface under various conditions and shows potential for improving a human’s thermal comfort during gait motion through informed footwear design. |
| first_indexed | 2024-04-13T11:15:13Z |
| format | Article |
| id | doaj.art-373f9178a65942cbbe9824e888330747 |
| institution | Directory Open Access Journal |
| issn | 2504-3900 |
| language | English |
| last_indexed | 2025-03-20T06:12:33Z |
| publishDate | 2018-02-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Proceedings |
| spelling | doaj.art-373f9178a65942cbbe9824e8883307472024-10-02T18:13:13ZengMDPI AGProceedings2504-39002018-02-012627810.3390/proceedings2060278proceedings2060278Novel Thermal Analysis Model of the Foot-Shoe Sole Interface during Gait MotionYasuhiro Shimazaki0Kazutoshi Aisaka1Department of Human Information Engineering, Okayama Prefectural University, Soja 719-1197, JapanDepartment of Human Information Engineering, Okayama Prefectural University, Soja 719-1197, JapanExcessive heat at the foot-shoe sole interface negatively affects a human’s thermal comfort. An understanding of the thermal behavior at this interface is important for alleviating this discomfort. During gait motion, a human’s body weight cyclically compresses a shoe sole (commonly constructed of viscoelastic materials), generating heat during loading. To evaluate the thermal effects of this internal heat generation on foot comfort, we developed and empirically validated a thermal analysis model during gait motion. A simple, one-dimensional prediction model for heat conduction with heat generation during compressive loading was used. Heat generation was estimated as a function of the shoe sole’s material properties (e.g., elastic modulus) and various gait parameters. When compared with experimental results, the proposed model proved effective in predicting thermal behavior at the foot-shoe sole interface under various conditions and shows potential for improving a human’s thermal comfort during gait motion through informed footwear design.http://www.mdpi.com/2504-3900/2/6/278heat transferfootwearcomfortethylene-vinyl acetate (EVA) rubberfoot contactmodelingwalking |
| spellingShingle | Yasuhiro Shimazaki Kazutoshi Aisaka Novel Thermal Analysis Model of the Foot-Shoe Sole Interface during Gait Motion Proceedings heat transfer footwear comfort ethylene-vinyl acetate (EVA) rubber foot contact modeling walking |
| title | Novel Thermal Analysis Model of the Foot-Shoe Sole Interface during Gait Motion |
| title_full | Novel Thermal Analysis Model of the Foot-Shoe Sole Interface during Gait Motion |
| title_fullStr | Novel Thermal Analysis Model of the Foot-Shoe Sole Interface during Gait Motion |
| title_full_unstemmed | Novel Thermal Analysis Model of the Foot-Shoe Sole Interface during Gait Motion |
| title_short | Novel Thermal Analysis Model of the Foot-Shoe Sole Interface during Gait Motion |
| title_sort | novel thermal analysis model of the foot shoe sole interface during gait motion |
| topic | heat transfer footwear comfort ethylene-vinyl acetate (EVA) rubber foot contact modeling walking |
| url | http://www.mdpi.com/2504-3900/2/6/278 |
| work_keys_str_mv | AT yasuhiroshimazaki novelthermalanalysismodelofthefootshoesoleinterfaceduringgaitmotion AT kazutoshiaisaka novelthermalanalysismodelofthefootshoesoleinterfaceduringgaitmotion |