Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping
Abstract Double-sided lapping is an precision machining method capable of obtaining high-precision surface. However, during the lapping process of thin pure copper substrate, the workpiece will be warped due to the influence of residual stress, including the machining stress and initial residual str...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
SpringerOpen
2023-02-01
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| Series: | Chinese Journal of Mechanical Engineering |
| Subjects: | |
| Online Access: | https://doi.org/10.1186/s10033-022-00824-y |
| _version_ | 1811165989863161856 |
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| author | Jiang Guo Zengxu He Bo Pan Bin Wang Qian Bai Jinxing Kong Renke Kang |
| author_facet | Jiang Guo Zengxu He Bo Pan Bin Wang Qian Bai Jinxing Kong Renke Kang |
| author_sort | Jiang Guo |
| collection | DOAJ |
| description | Abstract Double-sided lapping is an precision machining method capable of obtaining high-precision surface. However, during the lapping process of thin pure copper substrate, the workpiece will be warped due to the influence of residual stress, including the machining stress and initial residual stress, which will deteriorate the flatness of the workpiece and ultimately affect the performance of components. In this study, finite element method (FEM) was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping. Considering the initial residual stress of the workpiece, the stress caused by the lapping and their distribution characteristics, a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters. The results showed that the primary cause of the warping deformation of the workpiece in the double-sided lapping is the redistribution of initial residual stress caused by uneven material removal on the both surfaces. The finite element simulation results were in good agreement with the experimental results. |
| first_indexed | 2024-04-10T15:46:10Z |
| format | Article |
| id | doaj.art-3761b95dab4940d09385b547fb534604 |
| institution | Directory Open Access Journal |
| issn | 2192-8258 |
| language | English |
| last_indexed | 2024-04-10T15:46:10Z |
| publishDate | 2023-02-01 |
| publisher | SpringerOpen |
| record_format | Article |
| series | Chinese Journal of Mechanical Engineering |
| spelling | doaj.art-3761b95dab4940d09385b547fb5346042023-02-12T12:06:12ZengSpringerOpenChinese Journal of Mechanical Engineering2192-82582023-02-0136111010.1186/s10033-022-00824-yStress-Induced Deformation of Thin Copper Substrate in Double-Sided LappingJiang Guo0Zengxu He1Bo Pan2Bin Wang3Qian Bai4Jinxing Kong5Renke Kang6State Key Laboratory of High-Performance Precision Manufacturing, Department of Mechanical Engineering, Dalian University of TechnologyState Key Laboratory of High-Performance Precision Manufacturing, Department of Mechanical Engineering, Dalian University of TechnologyState Key Laboratory of High-Performance Precision Manufacturing, Department of Mechanical Engineering, Dalian University of TechnologyState Key Laboratory of High-Performance Precision Manufacturing, Department of Mechanical Engineering, Dalian University of TechnologyState Key Laboratory of High-Performance Precision Manufacturing, Department of Mechanical Engineering, Dalian University of TechnologyInstitute of Mechanical Manufacturing Technology, China Academy of Engineering PhysicsState Key Laboratory of High-Performance Precision Manufacturing, Department of Mechanical Engineering, Dalian University of TechnologyAbstract Double-sided lapping is an precision machining method capable of obtaining high-precision surface. However, during the lapping process of thin pure copper substrate, the workpiece will be warped due to the influence of residual stress, including the machining stress and initial residual stress, which will deteriorate the flatness of the workpiece and ultimately affect the performance of components. In this study, finite element method (FEM) was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping. Considering the initial residual stress of the workpiece, the stress caused by the lapping and their distribution characteristics, a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters. The results showed that the primary cause of the warping deformation of the workpiece in the double-sided lapping is the redistribution of initial residual stress caused by uneven material removal on the both surfaces. The finite element simulation results were in good agreement with the experimental results.https://doi.org/10.1186/s10033-022-00824-yMachining deformationDouble-sided lappingResidual stressFinite element simulation |
| spellingShingle | Jiang Guo Zengxu He Bo Pan Bin Wang Qian Bai Jinxing Kong Renke Kang Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping Chinese Journal of Mechanical Engineering Machining deformation Double-sided lapping Residual stress Finite element simulation |
| title | Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping |
| title_full | Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping |
| title_fullStr | Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping |
| title_full_unstemmed | Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping |
| title_short | Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping |
| title_sort | stress induced deformation of thin copper substrate in double sided lapping |
| topic | Machining deformation Double-sided lapping Residual stress Finite element simulation |
| url | https://doi.org/10.1186/s10033-022-00824-y |
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