Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping
Abstract Double-sided lapping is an precision machining method capable of obtaining high-precision surface. However, during the lapping process of thin pure copper substrate, the workpiece will be warped due to the influence of residual stress, including the machining stress and initial residual str...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
SpringerOpen
2023-02-01
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| Series: | Chinese Journal of Mechanical Engineering |
| Subjects: | |
| Online Access: | https://doi.org/10.1186/s10033-022-00824-y |