Improvement of thermal properties and flame retardancy of epoxy-amine thermosets by introducing bisphenol containing azomethine moiety

A novel bisphenol 1, 4'-bis{4-[(4-hydroxy) phenyliminomethylidene] phenoxy} benzene (BHPB), which contains azomethine moiety and flexible aromatic ether linkage, was synthesized and introduced into the curing system composed of diglycidyl ether of bisphenol A (DGEBA) and diamine. The curing beh...

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Bibliographic Details
Format: Article
Language:English
Published: Budapest University of Technology 2007-05-01
Series:eXPRESS Polymer Letters
Subjects:
Online Access:http://www.expresspolymlett.com/letolt.php?file=EPL-0000230&mi=cd
Description
Summary:A novel bisphenol 1, 4'-bis{4-[(4-hydroxy) phenyliminomethylidene] phenoxy} benzene (BHPB), which contains azomethine moiety and flexible aromatic ether linkage, was synthesized and introduced into the curing system composed of diglycidyl ether of bisphenol A (DGEBA) and diamine. The curing behavior of DGEBA/diamine changed dramatically due to the introduction of BHPB. The resultant epoxy thermosets containing BHPB had high Tgs (127-160 °C), high Td, 5% (>=330°C) and high integral procedure decomposition temperature (IPDT) values (662-1230°C) and good flame retardancy for their high Limited Oxygen Index (LOI) values (above 29.5).
ISSN:1788-618X