New Version of High-Damping PCB with Multi-Layered Viscous Lamina
In a previous study, a high-damping printed circuit board (PCB) implemented by multilayered viscoelastic acrylic tapes was investigated to increase the fatigue life of solder joints of electronic packages by vibration attenuation in a random vibration environment. However, the main drawback of this...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-07-01
|
| Series: | Aerospace |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2226-4310/8/8/202 |
| _version_ | 1827686280489598976 |
|---|---|
| author | Tae-Yong Park Seok-Jin Shin Hyun-Ung Oh |
| author_facet | Tae-Yong Park Seok-Jin Shin Hyun-Ung Oh |
| author_sort | Tae-Yong Park |
| collection | DOAJ |
| description | In a previous study, a high-damping printed circuit board (PCB) implemented by multilayered viscoelastic acrylic tapes was investigated to increase the fatigue life of solder joints of electronic packages by vibration attenuation in a random vibration environment. However, the main drawback of this concept is its inability to mount electronic parts on the PCB surface area occupied by interlaminated layers. For the efficient spatial accommodation of electronics, this paper proposes a new version of a high-damping PCB with multilayered viscoelastic tapes interlaminated on a thin metal stiffener spaced from a PCB. Compared to the previous study, this concept ensures efficient utilization of the PCB area for mounting electronic parts as well as the vibration attenuation capability. Free vibration tests were performed at various temperatures to obtain the basic characteristics of the proposed PCB. The effectiveness of the proposed PCB was verified by random vibration fatigue tests of sample PCBs with various numbers of viscoelastic layers to compare the fatigue life of electronic packages. |
| first_indexed | 2024-03-10T09:06:05Z |
| format | Article |
| id | doaj.art-387d75cbba57470aa7afedf1f761b6b5 |
| institution | Directory Open Access Journal |
| issn | 2226-4310 |
| language | English |
| last_indexed | 2024-03-10T09:06:05Z |
| publishDate | 2021-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Aerospace |
| spelling | doaj.art-387d75cbba57470aa7afedf1f761b6b52023-11-22T06:21:46ZengMDPI AGAerospace2226-43102021-07-018820210.3390/aerospace8080202New Version of High-Damping PCB with Multi-Layered Viscous LaminaTae-Yong Park0Seok-Jin Shin1Hyun-Ung Oh2Soletop Co., Ltd., 409 Expo-ro, Yuseong-gu, Daejeon 34051, KoreaDrive Concept Development Team, Hyundai Motor Group, 150, Yonguso-ro, Namyang-eup, Hwaseong-si 18280, KoreaSpace Technology Synthesis Laboratory, Department of Smart Vehicle System Engineering, Chosun University, 309, Pilmun-daero, Dong-gu, Gwangju City 61452, KoreaIn a previous study, a high-damping printed circuit board (PCB) implemented by multilayered viscoelastic acrylic tapes was investigated to increase the fatigue life of solder joints of electronic packages by vibration attenuation in a random vibration environment. However, the main drawback of this concept is its inability to mount electronic parts on the PCB surface area occupied by interlaminated layers. For the efficient spatial accommodation of electronics, this paper proposes a new version of a high-damping PCB with multilayered viscoelastic tapes interlaminated on a thin metal stiffener spaced from a PCB. Compared to the previous study, this concept ensures efficient utilization of the PCB area for mounting electronic parts as well as the vibration attenuation capability. Free vibration tests were performed at various temperatures to obtain the basic characteristics of the proposed PCB. The effectiveness of the proposed PCB was verified by random vibration fatigue tests of sample PCBs with various numbers of viscoelastic layers to compare the fatigue life of electronic packages.https://www.mdpi.com/2226-4310/8/8/202high-damping PCBviscous laminafatigue liferandom vibrationvibration attenuation |
| spellingShingle | Tae-Yong Park Seok-Jin Shin Hyun-Ung Oh New Version of High-Damping PCB with Multi-Layered Viscous Lamina Aerospace high-damping PCB viscous lamina fatigue life random vibration vibration attenuation |
| title | New Version of High-Damping PCB with Multi-Layered Viscous Lamina |
| title_full | New Version of High-Damping PCB with Multi-Layered Viscous Lamina |
| title_fullStr | New Version of High-Damping PCB with Multi-Layered Viscous Lamina |
| title_full_unstemmed | New Version of High-Damping PCB with Multi-Layered Viscous Lamina |
| title_short | New Version of High-Damping PCB with Multi-Layered Viscous Lamina |
| title_sort | new version of high damping pcb with multi layered viscous lamina |
| topic | high-damping PCB viscous lamina fatigue life random vibration vibration attenuation |
| url | https://www.mdpi.com/2226-4310/8/8/202 |
| work_keys_str_mv | AT taeyongpark newversionofhighdampingpcbwithmultilayeredviscouslamina AT seokjinshin newversionofhighdampingpcbwithmultilayeredviscouslamina AT hyunungoh newversionofhighdampingpcbwithmultilayeredviscouslamina |