Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives
The increasing complexity of printed circuit boards (PCBs) due to miniaturization, increased the density of electronic components, and demanding thermal management during the assembly triggered the research of innovative solder pastes and electrically conductive adhesives (ECAs). Current commercial...
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| Format: | Article |
| Language: | English |
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MDPI AG
2020-08-01
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| Series: | Journal of Composites Science |
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| Online Access: | https://www.mdpi.com/2504-477X/4/3/105 |
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| author | Paulo E. Lopes Duarte Moura Loic Hilliou Beate Krause Petra Pötschke Hugo Figueiredo Ricardo Alves Emmanuel Lepleux Louis Pacheco Maria C. Paiva |
| author_facet | Paulo E. Lopes Duarte Moura Loic Hilliou Beate Krause Petra Pötschke Hugo Figueiredo Ricardo Alves Emmanuel Lepleux Louis Pacheco Maria C. Paiva |
| author_sort | Paulo E. Lopes |
| collection | DOAJ |
| description | The increasing complexity of printed circuit boards (PCBs) due to miniaturization, increased the density of electronic components, and demanding thermal management during the assembly triggered the research of innovative solder pastes and electrically conductive adhesives (ECAs). Current commercial ECAs are typically based on epoxy matrices with a high load (>60%) of silver particles, generally in the form of microflakes. The present work reports the production of ECAs based on epoxy/carbon nanomaterials using carbon nanotubes (single and multi-walled) and exfoliated graphite, as well as hybrid compositions, within a range of concentrations. The composites were tested for morphology (dispersion of the conductive nanomaterials), electrical and thermal conductivity, rheological characteristics and deposition on a test PCB. Finally, the ECA’s shelf life was assessed by mixing all the components and conductive nanomaterials, and evaluating the cure of the resin before and after freezing for a time range up to nine months. The ECAs produced could be stored at −18 °C without affecting the cure reaction. |
| first_indexed | 2024-03-10T18:01:58Z |
| format | Article |
| id | doaj.art-39f6e4f36ae04a12b7ac120784b2b19a |
| institution | Directory Open Access Journal |
| issn | 2504-477X |
| language | English |
| last_indexed | 2024-03-10T18:01:58Z |
| publishDate | 2020-08-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Journal of Composites Science |
| spelling | doaj.art-39f6e4f36ae04a12b7ac120784b2b19a2023-11-20T08:48:06ZengMDPI AGJournal of Composites Science2504-477X2020-08-014310510.3390/jcs4030105Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive AdhesivesPaulo E. Lopes0Duarte Moura1Loic Hilliou2Beate Krause3Petra Pötschke4Hugo Figueiredo5Ricardo Alves6Emmanuel Lepleux7Louis Pacheco8Maria C. Paiva9Instituto de Polímeros e Compósitos (IPC), Universidade do Minho, 4804-533 Guimarães, PortugalInstituto de Polímeros e Compósitos (IPC), Universidade do Minho, 4804-533 Guimarães, PortugalInstituto de Polímeros e Compósitos (IPC), Universidade do Minho, 4804-533 Guimarães, PortugalLeibniz Institute of Polymer Research Dresden (IPF Dresden), Hohe Str 6, D-01069 Dresden, GermanyLeibniz Institute of Polymer Research Dresden (IPF Dresden), Hohe Str 6, D-01069 Dresden, GermanyCM/MFT3 Bosch, 4705-820 Braga, PortugalCM/MFT3 Bosch, 4705-820 Braga, PortugalConcept Scientific Instruments (CSI), 1 Terre de Feu, 91940 Les Ulis, FranceConcept Scientific Instruments (CSI), 1 Terre de Feu, 91940 Les Ulis, FranceInstituto de Polímeros e Compósitos (IPC), Universidade do Minho, 4804-533 Guimarães, PortugalThe increasing complexity of printed circuit boards (PCBs) due to miniaturization, increased the density of electronic components, and demanding thermal management during the assembly triggered the research of innovative solder pastes and electrically conductive adhesives (ECAs). Current commercial ECAs are typically based on epoxy matrices with a high load (>60%) of silver particles, generally in the form of microflakes. The present work reports the production of ECAs based on epoxy/carbon nanomaterials using carbon nanotubes (single and multi-walled) and exfoliated graphite, as well as hybrid compositions, within a range of concentrations. The composites were tested for morphology (dispersion of the conductive nanomaterials), electrical and thermal conductivity, rheological characteristics and deposition on a test PCB. Finally, the ECA’s shelf life was assessed by mixing all the components and conductive nanomaterials, and evaluating the cure of the resin before and after freezing for a time range up to nine months. The ECAs produced could be stored at −18 °C without affecting the cure reaction.https://www.mdpi.com/2504-477X/4/3/105ECA electrically conductive adhesivecarbon nanotubesexfoliated graphiteelectronic packagingepoxy |
| spellingShingle | Paulo E. Lopes Duarte Moura Loic Hilliou Beate Krause Petra Pötschke Hugo Figueiredo Ricardo Alves Emmanuel Lepleux Louis Pacheco Maria C. Paiva Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives Journal of Composites Science ECA electrically conductive adhesive carbon nanotubes exfoliated graphite electronic packaging epoxy |
| title | Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives |
| title_full | Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives |
| title_fullStr | Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives |
| title_full_unstemmed | Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives |
| title_short | Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives |
| title_sort | mixed carbon nanomaterial epoxy resin for electrically conductive adhesives |
| topic | ECA electrically conductive adhesive carbon nanotubes exfoliated graphite electronic packaging epoxy |
| url | https://www.mdpi.com/2504-477X/4/3/105 |
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