Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives

Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives

The increasing complexity of printed circuit boards (PCBs) due to miniaturization, increased the density of electronic components, and demanding thermal management during the assembly triggered the research of innovative solder pastes and electrically conductive adhesives (ECAs). Current commercial...

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Bibliographic Details
Main Authors: Paulo E. Lopes, Duarte Moura, Loic Hilliou, Beate Krause, Petra Pötschke, Hugo Figueiredo, Ricardo Alves, Emmanuel Lepleux, Louis Pacheco, Maria C. Paiva
Format: Article
Language:English
Published: MDPI AG 2020-08-01
Series:Journal of Composites Science
Subjects:
ECA electrically conductive adhesive
carbon nanotubes
exfoliated graphite
electronic packaging
epoxy
Online Access:https://www.mdpi.com/2504-477X/4/3/105

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