Methods for Vibration Reduction in Enclosed Electronic Packages
Excitation and transmission of vibration inside electronic packages are strongly connected with mechanical characteristics of their enclosure, which are in the objective for the current research aimed at developing methods and means to reduce vibration inside the enclosure case. The main idea of the...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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EDP Sciences
2019-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | https://www.matec-conferences.org/articles/matecconf/pdf/2019/51/matecconf_diagnostyka2019_01008.pdf |
| _version_ | 1818858725371281408 |
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| author | Kovtun Igor Boiko Juliy Petrashchuk Svitlana Kałaczyński Tomasz |
| author_facet | Kovtun Igor Boiko Juliy Petrashchuk Svitlana Kałaczyński Tomasz |
| author_sort | Kovtun Igor |
| collection | DOAJ |
| description | Excitation and transmission of vibration inside electronic packages are strongly connected with mechanical characteristics of their enclosure, which are in the objective for the current research aimed at developing methods and means to reduce vibration inside the enclosure case. The main idea of the introduced methods is in creating elastic and dissipative mechanical joints between structural elements, which appear to be the links for vibration transmission, inside and outside of the electronic package enclosure. The effectiveness of developed methods is proved by experimental verification and theoretical foundation. |
| first_indexed | 2024-12-19T09:00:51Z |
| format | Article |
| id | doaj.art-3a5dcebecbb6490592516d086a89de29 |
| institution | Directory Open Access Journal |
| issn | 2261-236X |
| language | English |
| last_indexed | 2024-12-19T09:00:51Z |
| publishDate | 2019-01-01 |
| publisher | EDP Sciences |
| record_format | Article |
| series | MATEC Web of Conferences |
| spelling | doaj.art-3a5dcebecbb6490592516d086a89de292022-12-21T20:28:29ZengEDP SciencesMATEC Web of Conferences2261-236X2019-01-013020100810.1051/matecconf/201930201008matecconf_diagnostyka2019_01008Methods for Vibration Reduction in Enclosed Electronic PackagesKovtun Igor0Boiko Juliy1Petrashchuk Svitlana2Kałaczyński Tomasz3Technologies and Design Faculty in Khmelnytsky National University, Department of Art and Technical GraphicsProgramming and Computer, Telecommunication Systems Faculty in Khmelnytsky National University, Department of Telecommunication and Radio EngineeringTechnologies and Design Faculty in Khmelnytsky National University, Department of Art and Technical GraphicsFaculty of Mechanical Engineering UTP in Bydgoszcz, Department of Vehicle EngineeringExcitation and transmission of vibration inside electronic packages are strongly connected with mechanical characteristics of their enclosure, which are in the objective for the current research aimed at developing methods and means to reduce vibration inside the enclosure case. The main idea of the introduced methods is in creating elastic and dissipative mechanical joints between structural elements, which appear to be the links for vibration transmission, inside and outside of the electronic package enclosure. The effectiveness of developed methods is proved by experimental verification and theoretical foundation.https://www.matec-conferences.org/articles/matecconf/pdf/2019/51/matecconf_diagnostyka2019_01008.pdf |
| spellingShingle | Kovtun Igor Boiko Juliy Petrashchuk Svitlana Kałaczyński Tomasz Methods for Vibration Reduction in Enclosed Electronic Packages MATEC Web of Conferences |
| title | Methods for Vibration Reduction in Enclosed Electronic Packages |
| title_full | Methods for Vibration Reduction in Enclosed Electronic Packages |
| title_fullStr | Methods for Vibration Reduction in Enclosed Electronic Packages |
| title_full_unstemmed | Methods for Vibration Reduction in Enclosed Electronic Packages |
| title_short | Methods for Vibration Reduction in Enclosed Electronic Packages |
| title_sort | methods for vibration reduction in enclosed electronic packages |
| url | https://www.matec-conferences.org/articles/matecconf/pdf/2019/51/matecconf_diagnostyka2019_01008.pdf |
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