MEMS High Aspect Ratio Trench Three-Dimensional Measurement Using Through-Focus Scanning Optical Microscopy and Deep Learning Method

MEMS High Aspect Ratio Trench Three-Dimensional Measurement Using Through-Focus Scanning Optical Microscopy and Deep Learning Method

High-aspect-ratio structures have become increasingly important in MEMS devices. In situ, real-time critical dimension and depth measurement for high-aspect-ratio structures is critical for optimizing the deep etching process. Through-focus scanning optical microscopy (TSOM) is a high-throughput and...

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Bibliographic Details
Main Authors: Guannan Li, Junkai Shi, Chao Gao, Xingjian Jiang, Shuchun Huo, Chengjun Cui, Xiaomei Chen, Weihu Zhou
Format: Article
Language:English
Published: MDPI AG 2022-08-01
Series:Applied Sciences
Subjects:
optical micro-nano metrology
three-dimensional non-destructive measurement
high-aspect-ratio structure
through-focus scanning optical microscopy
convolutional neural network
Online Access:https://www.mdpi.com/2076-3417/12/17/8396

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