Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics
In this study, we have developed an amplifier waveguide module suitable for broadband communication in the sub-THz band. To achieve a waveguide module with excellent gain flatness characteristics, the effects of errors during the packaging procedures of the waveguide module and the space occupied by...
Main Authors: | , , , , , , , , |
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Format: | Article |
Language: | English |
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The Korean Institute of Electromagnetic Engineering and Science
2023-11-01
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Series: | Journal of Electromagnetic Engineering and Science |
Subjects: | |
Online Access: | https://www.jees.kr/upload/pdf/jees-2023-6-r-192.pdf |
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author | Sooyeon Kim Chan-Gyu Choi Sang-Rok Moon Minkyu Sung Eon-sang Kim Ho-Jin Song Hyunhak Jeong Seung Hwan Kim Seung-Hyun Cho |
author_facet | Sooyeon Kim Chan-Gyu Choi Sang-Rok Moon Minkyu Sung Eon-sang Kim Ho-Jin Song Hyunhak Jeong Seung Hwan Kim Seung-Hyun Cho |
author_sort | Sooyeon Kim |
collection | DOAJ |
description | In this study, we have developed an amplifier waveguide module suitable for broadband communication in the sub-THz band. To achieve a waveguide module with excellent gain flatness characteristics, the effects of errors during the packaging procedures of the waveguide module and the space occupied by the bondwire were analyzed through an electromagnetic simulation. Furthermore, a photonics-based sub-THz wireless link with a carrier frequency of 288 GHz was established using a packaged amplifier module. The amplifier module was placed at the output of the sub-THz transmitter based on a uni-traveling-carrier photodiode and at the input of the sub-THz receiver. The maximum gain and 3 dB bandwidth of the amplifier module are 17.3 dB and 39 GHz, respectively. With this setup, we successfully transmitted a 100-Gbps 16-QAM modulated signal, employing a carrier frequency of 288 GHz, across a wireless distance of 100 m. |
first_indexed | 2024-03-09T00:18:08Z |
format | Article |
id | doaj.art-3a825716b07646a5bbc98cac4dc879e5 |
institution | Directory Open Access Journal |
issn | 2671-7255 2671-7263 |
language | English |
last_indexed | 2024-03-09T00:18:08Z |
publishDate | 2023-11-01 |
publisher | The Korean Institute of Electromagnetic Engineering and Science |
record_format | Article |
series | Journal of Electromagnetic Engineering and Science |
spelling | doaj.art-3a825716b07646a5bbc98cac4dc879e52023-12-12T06:28:26ZengThe Korean Institute of Electromagnetic Engineering and ScienceJournal of Electromagnetic Engineering and Science2671-72552671-72632023-11-0123647048110.26866/jees.2023.6.r.1923627Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on PhotonicsSooyeon Kim0Chan-Gyu Choi1Sang-Rok Moon2Minkyu Sung3Eon-sang Kim4Ho-Jin Song5Hyunhak Jeong6Seung Hwan Kim7Seung-Hyun Cho8 Optical Network Research Section, Electronics and Telecommunications Research Institute, Daejeon, Korea School of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea Optical Network Research Section, Electronics and Telecommunications Research Institute, Daejeon, Korea Optical Network Research Section, Electronics and Telecommunications Research Institute, Daejeon, Korea Optical Network Research Section, Electronics and Telecommunications Research Institute, Daejeon, Korea School of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea School of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea Optical Network Research Section, Electronics and Telecommunications Research Institute, Daejeon, Korea Optical Network Research Section, Electronics and Telecommunications Research Institute, Daejeon, KoreaIn this study, we have developed an amplifier waveguide module suitable for broadband communication in the sub-THz band. To achieve a waveguide module with excellent gain flatness characteristics, the effects of errors during the packaging procedures of the waveguide module and the space occupied by the bondwire were analyzed through an electromagnetic simulation. Furthermore, a photonics-based sub-THz wireless link with a carrier frequency of 288 GHz was established using a packaged amplifier module. The amplifier module was placed at the output of the sub-THz transmitter based on a uni-traveling-carrier photodiode and at the input of the sub-THz receiver. The maximum gain and 3 dB bandwidth of the amplifier module are 17.3 dB and 39 GHz, respectively. With this setup, we successfully transmitted a 100-Gbps 16-QAM modulated signal, employing a carrier frequency of 288 GHz, across a wireless distance of 100 m.https://www.jees.kr/upload/pdf/jees-2023-6-r-192.pdfamplifierpackagingsub-thzwaveguide module |
spellingShingle | Sooyeon Kim Chan-Gyu Choi Sang-Rok Moon Minkyu Sung Eon-sang Kim Ho-Jin Song Hyunhak Jeong Seung Hwan Kim Seung-Hyun Cho Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics Journal of Electromagnetic Engineering and Science amplifier packaging sub-thz waveguide module |
title | Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics |
title_full | Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics |
title_fullStr | Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics |
title_full_unstemmed | Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics |
title_short | Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics |
title_sort | packaging of an amplifier module for sub thz wireless transmission based on photonics |
topic | amplifier packaging sub-thz waveguide module |
url | https://www.jees.kr/upload/pdf/jees-2023-6-r-192.pdf |
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