Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics

In this study, we have developed an amplifier waveguide module suitable for broadband communication in the sub-THz band. To achieve a waveguide module with excellent gain flatness characteristics, the effects of errors during the packaging procedures of the waveguide module and the space occupied by...

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Main Authors: Sooyeon Kim, Chan-Gyu Choi, Sang-Rok Moon, Minkyu Sung, Eon-sang Kim, Ho-Jin Song, Hyunhak Jeong, Seung Hwan Kim, Seung-Hyun Cho
Format: Article
Language:English
Published: The Korean Institute of Electromagnetic Engineering and Science 2023-11-01
Series:Journal of Electromagnetic Engineering and Science
Subjects:
Online Access:https://www.jees.kr/upload/pdf/jees-2023-6-r-192.pdf
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author Sooyeon Kim
Chan-Gyu Choi
Sang-Rok Moon
Minkyu Sung
Eon-sang Kim
Ho-Jin Song
Hyunhak Jeong
Seung Hwan Kim
Seung-Hyun Cho
author_facet Sooyeon Kim
Chan-Gyu Choi
Sang-Rok Moon
Minkyu Sung
Eon-sang Kim
Ho-Jin Song
Hyunhak Jeong
Seung Hwan Kim
Seung-Hyun Cho
author_sort Sooyeon Kim
collection DOAJ
description In this study, we have developed an amplifier waveguide module suitable for broadband communication in the sub-THz band. To achieve a waveguide module with excellent gain flatness characteristics, the effects of errors during the packaging procedures of the waveguide module and the space occupied by the bondwire were analyzed through an electromagnetic simulation. Furthermore, a photonics-based sub-THz wireless link with a carrier frequency of 288 GHz was established using a packaged amplifier module. The amplifier module was placed at the output of the sub-THz transmitter based on a uni-traveling-carrier photodiode and at the input of the sub-THz receiver. The maximum gain and 3 dB bandwidth of the amplifier module are 17.3 dB and 39 GHz, respectively. With this setup, we successfully transmitted a 100-Gbps 16-QAM modulated signal, employing a carrier frequency of 288 GHz, across a wireless distance of 100 m.
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spelling doaj.art-3a825716b07646a5bbc98cac4dc879e52023-12-12T06:28:26ZengThe Korean Institute of Electromagnetic Engineering and ScienceJournal of Electromagnetic Engineering and Science2671-72552671-72632023-11-0123647048110.26866/jees.2023.6.r.1923627Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on PhotonicsSooyeon Kim0Chan-Gyu Choi1Sang-Rok Moon2Minkyu Sung3Eon-sang Kim4Ho-Jin Song5Hyunhak Jeong6Seung Hwan Kim7Seung-Hyun Cho8 Optical Network Research Section, Electronics and Telecommunications Research Institute, Daejeon, Korea School of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea Optical Network Research Section, Electronics and Telecommunications Research Institute, Daejeon, Korea Optical Network Research Section, Electronics and Telecommunications Research Institute, Daejeon, Korea Optical Network Research Section, Electronics and Telecommunications Research Institute, Daejeon, Korea School of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea School of Electrical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Korea Optical Network Research Section, Electronics and Telecommunications Research Institute, Daejeon, Korea Optical Network Research Section, Electronics and Telecommunications Research Institute, Daejeon, KoreaIn this study, we have developed an amplifier waveguide module suitable for broadband communication in the sub-THz band. To achieve a waveguide module with excellent gain flatness characteristics, the effects of errors during the packaging procedures of the waveguide module and the space occupied by the bondwire were analyzed through an electromagnetic simulation. Furthermore, a photonics-based sub-THz wireless link with a carrier frequency of 288 GHz was established using a packaged amplifier module. The amplifier module was placed at the output of the sub-THz transmitter based on a uni-traveling-carrier photodiode and at the input of the sub-THz receiver. The maximum gain and 3 dB bandwidth of the amplifier module are 17.3 dB and 39 GHz, respectively. With this setup, we successfully transmitted a 100-Gbps 16-QAM modulated signal, employing a carrier frequency of 288 GHz, across a wireless distance of 100 m.https://www.jees.kr/upload/pdf/jees-2023-6-r-192.pdfamplifierpackagingsub-thzwaveguide module
spellingShingle Sooyeon Kim
Chan-Gyu Choi
Sang-Rok Moon
Minkyu Sung
Eon-sang Kim
Ho-Jin Song
Hyunhak Jeong
Seung Hwan Kim
Seung-Hyun Cho
Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics
Journal of Electromagnetic Engineering and Science
amplifier
packaging
sub-thz
waveguide module
title Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics
title_full Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics
title_fullStr Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics
title_full_unstemmed Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics
title_short Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics
title_sort packaging of an amplifier module for sub thz wireless transmission based on photonics
topic amplifier
packaging
sub-thz
waveguide module
url https://www.jees.kr/upload/pdf/jees-2023-6-r-192.pdf
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