Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics

Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics

In this study, we have developed an amplifier waveguide module suitable for broadband communication in the sub-THz band. To achieve a waveguide module with excellent gain flatness characteristics, the effects of errors during the packaging procedures of the waveguide module and the space occupied by...

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Bibliographic Details
Main Authors: Sooyeon Kim, Chan-Gyu Choi, Sang-Rok Moon, Minkyu Sung, Eon-sang Kim, Ho-Jin Song, Hyunhak Jeong, Seung Hwan Kim, Seung-Hyun Cho
Format: Article
Language:English
Published: The Korean Institute of Electromagnetic Engineering and Science 2023-11-01
Series:Journal of Electromagnetic Engineering and Science
Subjects:
amplifier
packaging
sub-thz
waveguide module
Online Access:https://www.jees.kr/upload/pdf/jees-2023-6-r-192.pdf

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