Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties

In this study, we present a facile method for preparing oxidation-resistant Cu nanoparticles through a liquid-phase reduction with imidazole compounds (imidazole, 2-methylimidazole, 2-phenylimidazole, and benzimidazole) that serve as protective and dispersing agents. Through a complexation reaction...

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Main Authors: Yu Zhang, Xianchong Yu, Ziyuan Chen, Song Wu, Haiqi Lai, Shiwo Ta, Tingyu Lin, Guannan Yang, Chengqiang Cui
Format: Article
Language:English
Published: MDPI AG 2023-11-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/14/11/2079
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author Yu Zhang
Xianchong Yu
Ziyuan Chen
Song Wu
Haiqi Lai
Shiwo Ta
Tingyu Lin
Guannan Yang
Chengqiang Cui
author_facet Yu Zhang
Xianchong Yu
Ziyuan Chen
Song Wu
Haiqi Lai
Shiwo Ta
Tingyu Lin
Guannan Yang
Chengqiang Cui
author_sort Yu Zhang
collection DOAJ
description In this study, we present a facile method for preparing oxidation-resistant Cu nanoparticles through a liquid-phase reduction with imidazole compounds (imidazole, 2-methylimidazole, 2-phenylimidazole, and benzimidazole) that serve as protective and dispersing agents. Through a complexation reaction between Cu atoms, the imidazole compounds can form a protective film on the Cu nanoparticles to prevent the particles from rapidly oxidizing. We compared the effects of the four kinds of imidazole compounds on the oxidation resistance and sintering properties of Cu particles. The Cu particles prepared with benzimidazole could be stored in the air for 30 days without being oxidized. After sintering at 300 °C and 2 MPa, the joint of the particles could reach a shear strength of 32 MPa, which meets the requirements for microelectronic packaging.
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spelling doaj.art-3a9f61a7181742c18343d34d2f7b4a8b2023-11-24T14:56:29ZengMDPI AGMicromachines2072-666X2023-11-011411207910.3390/mi14112079Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering PropertiesYu Zhang0Xianchong Yu1Ziyuan Chen2Song Wu3Haiqi Lai4Shiwo Ta5Tingyu Lin6Guannan Yang7Chengqiang Cui8State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaState Key Laboratory of Advanced Materials and Electronic Components, Fenghua Advanced Technology Co., Ltd., Zhaoqing 526020, ChinaGuangdong Fozhixin Microelectronics Technology Research Co., Ltd., Foshan 528200, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaState Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, ChinaIn this study, we present a facile method for preparing oxidation-resistant Cu nanoparticles through a liquid-phase reduction with imidazole compounds (imidazole, 2-methylimidazole, 2-phenylimidazole, and benzimidazole) that serve as protective and dispersing agents. Through a complexation reaction between Cu atoms, the imidazole compounds can form a protective film on the Cu nanoparticles to prevent the particles from rapidly oxidizing. We compared the effects of the four kinds of imidazole compounds on the oxidation resistance and sintering properties of Cu particles. The Cu particles prepared with benzimidazole could be stored in the air for 30 days without being oxidized. After sintering at 300 °C and 2 MPa, the joint of the particles could reach a shear strength of 32 MPa, which meets the requirements for microelectronic packaging.https://www.mdpi.com/2072-666X/14/11/2079Cu nanoparticlesimidazole compoundssintering propertiesoxidation resistancecomplexing effect
spellingShingle Yu Zhang
Xianchong Yu
Ziyuan Chen
Song Wu
Haiqi Lai
Shiwo Ta
Tingyu Lin
Guannan Yang
Chengqiang Cui
Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties
Micromachines
Cu nanoparticles
imidazole compounds
sintering properties
oxidation resistance
complexing effect
title Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties
title_full Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties
title_fullStr Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties
title_full_unstemmed Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties
title_short Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties
title_sort synthesis of imidazole compound coated copper nanoparticles with promising antioxidant and sintering properties
topic Cu nanoparticles
imidazole compounds
sintering properties
oxidation resistance
complexing effect
url https://www.mdpi.com/2072-666X/14/11/2079
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