Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites
Cyclotriphosphazenes, a variety of inorganic rings together with a curing ingredient, 4,4′-methylene dianiline (MDA), are mainly used to enhance the thermal conductivity and mechanical characteristics of epoxy resin (DGEBA). Three DGEBA@MDA, HGCP@MDA, and thermosets were produced, and their curing b...
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MDPI AG
2023-03-01
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| Online Access: | https://www.mdpi.com/2073-4352/13/3/478 |
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| author | Omar Dagdag Lahoucine El Gana Rajesh Haldhar Avni Berisha Seong-Cheol Kim Elyor Berdimurodov Othman Hamed Shehdeh Jodeh Ekemini Daniel Akpan Eno Effiong Ebenso |
| author_facet | Omar Dagdag Lahoucine El Gana Rajesh Haldhar Avni Berisha Seong-Cheol Kim Elyor Berdimurodov Othman Hamed Shehdeh Jodeh Ekemini Daniel Akpan Eno Effiong Ebenso |
| author_sort | Omar Dagdag |
| collection | DOAJ |
| description | Cyclotriphosphazenes, a variety of inorganic rings together with a curing ingredient, 4,4′-methylene dianiline (MDA), are mainly used to enhance the thermal conductivity and mechanical characteristics of epoxy resin (DGEBA). Three DGEBA@MDA, HGCP@MDA, and thermosets were produced, and their curing behaviors were investigated. Using a molecular dynamics (MD) approach, the impact of cyclotriphosphazene on the characteristics of DGEBA composites is thoroughly explored in this paper. Results indicated that the glass transition temperatures (<i>T<sub>g</sub></i>) of DGEBA containing HGCP had slightly decreased compared to DGEBA. With the addition of HGCP to DGEBA, epoxy resin (DGEBA@HGCP@MDA) has a high thermal conductivity of 0.215284 W/m·K, with an increase of 116.04% more than pure DGEBA (0.185524 W/m·K). Moreover, the DGEBA@HGCP@MDA composite has high mechanical strength with a specific Young’s modulus of 5.4902 GPa. In order to forecast and analyze certain performances directly associated with the microstructure characteristics of the various cross-linked resin systems and their composite materials, an MD simulation approach will be quite valuable. |
| first_indexed | 2024-03-11T06:42:35Z |
| format | Article |
| id | doaj.art-3bf531cd4c6243b99649daa8d412d00d |
| institution | Directory Open Access Journal |
| issn | 2073-4352 |
| language | English |
| last_indexed | 2024-03-11T06:42:35Z |
| publishDate | 2023-03-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Crystals |
| spelling | doaj.art-3bf531cd4c6243b99649daa8d412d00d2023-11-17T10:29:20ZengMDPI AGCrystals2073-43522023-03-0113347810.3390/cryst13030478Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin CompositesOmar Dagdag0Lahoucine El Gana1Rajesh Haldhar2Avni Berisha3Seong-Cheol Kim4Elyor Berdimurodov5Othman Hamed6Shehdeh Jodeh7Ekemini Daniel Akpan8Eno Effiong Ebenso9Centre for Materials Science, College of Science, Engineering, and Technology, University of South Africa, Johannesburg 1710, South AfricaLaboratory of Materials Physics and Subatomic, Department of Physics, Faculty of Sciences, Ibn Tofail University, BP 133, Kenitra 14000, MoroccoSchool of Chemical Engineering, Yeungnam University, Gyeongsan 38541, Republic of KoreaDepartment of Chemistry, Faculty of Natural and Mathematics Science, University of Prishtina, 10000 Prishtina, KosovoSchool of Chemical Engineering, Yeungnam University, Gyeongsan 38541, Republic of KoreaFaculty of Chemistry, National University of Uzbekistan, Tashkent 100034, UzbekistanDepartment of Chemistry, An-Najah National University, Nablus P.O. Box 7, PalestineDepartment of Chemistry, An-Najah National University, Nablus P.O. Box 7, PalestineCentre for Materials Science, College of Science, Engineering, and Technology, University of South Africa, Johannesburg 1710, South AfricaCentre for Materials Science, College of Science, Engineering, and Technology, University of South Africa, Johannesburg 1710, South AfricaCyclotriphosphazenes, a variety of inorganic rings together with a curing ingredient, 4,4′-methylene dianiline (MDA), are mainly used to enhance the thermal conductivity and mechanical characteristics of epoxy resin (DGEBA). Three DGEBA@MDA, HGCP@MDA, and thermosets were produced, and their curing behaviors were investigated. Using a molecular dynamics (MD) approach, the impact of cyclotriphosphazene on the characteristics of DGEBA composites is thoroughly explored in this paper. Results indicated that the glass transition temperatures (<i>T<sub>g</sub></i>) of DGEBA containing HGCP had slightly decreased compared to DGEBA. With the addition of HGCP to DGEBA, epoxy resin (DGEBA@HGCP@MDA) has a high thermal conductivity of 0.215284 W/m·K, with an increase of 116.04% more than pure DGEBA (0.185524 W/m·K). Moreover, the DGEBA@HGCP@MDA composite has high mechanical strength with a specific Young’s modulus of 5.4902 GPa. In order to forecast and analyze certain performances directly associated with the microstructure characteristics of the various cross-linked resin systems and their composite materials, an MD simulation approach will be quite valuable.https://www.mdpi.com/2073-4352/13/3/478Cyclotriphosphazenesepoxy resinDGEBAHGCPthermal conductivitymechanical properties |
| spellingShingle | Omar Dagdag Lahoucine El Gana Rajesh Haldhar Avni Berisha Seong-Cheol Kim Elyor Berdimurodov Othman Hamed Shehdeh Jodeh Ekemini Daniel Akpan Eno Effiong Ebenso Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites Crystals Cyclotriphosphazenes epoxy resin DGEBA HGCP thermal conductivity mechanical properties |
| title | Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites |
| title_full | Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites |
| title_fullStr | Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites |
| title_full_unstemmed | Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites |
| title_short | Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites |
| title_sort | study on thermal conductivity and mechanical properties of cyclotriphosphazene resin forced epoxy resin composites |
| topic | Cyclotriphosphazenes epoxy resin DGEBA HGCP thermal conductivity mechanical properties |
| url | https://www.mdpi.com/2073-4352/13/3/478 |
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