Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites

Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites

Cyclotriphosphazenes, a variety of inorganic rings together with a curing ingredient, 4,4′-methylene dianiline (MDA), are mainly used to enhance the thermal conductivity and mechanical characteristics of epoxy resin (DGEBA). Three DGEBA@MDA, HGCP@MDA, and thermosets were produced, and their curing b...

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Bibliographic Details
Main Authors: Omar Dagdag, Lahoucine El Gana, Rajesh Haldhar, Avni Berisha, Seong-Cheol Kim, Elyor Berdimurodov, Othman Hamed, Shehdeh Jodeh, Ekemini Daniel Akpan, Eno Effiong Ebenso
Format: Article
Language:English
Published: MDPI AG 2023-03-01
Series:Crystals
Subjects:
Cyclotriphosphazenes
epoxy resin
DGEBA
HGCP
thermal conductivity
mechanical properties
Online Access:https://www.mdpi.com/2073-4352/13/3/478

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