Preparation and properties of mesoporous silica/bismaleimide/diallylbisphenol composites with improved thermal stability, mechanical and dielectric properties

New composites with improved thermal stability, mechanical and dielectric properties were developed, which consist of 2,2'-diallylbisphenol A (DBA)/4,4'-bismaleimidodiphenylmethane (BDM) resin and a new kind of organic/inorganic mesoporous silica (MPSA). Typical properties (curing behavior...

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Format: Article
Language:English
Published: Budapest University of Technology 2011-06-01
Series:eXPRESS Polymer Letters
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Online Access:http://www.expresspolymlett.com/letolt.php?file=EPL-0002192&mi=cd
_version_ 1818208805334286336
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description New composites with improved thermal stability, mechanical and dielectric properties were developed, which consist of 2,2'-diallylbisphenol A (DBA)/4,4'-bismaleimidodiphenylmethane (BDM) resin and a new kind of organic/inorganic mesoporous silica (MPSA). Typical properties (curing behavior and mechanism, thermal stability, mechanical and dielectric properties) of the composites were systematically investigated, and their origins were discussed. Results show that MPSA/DBA/BDM composites have similar curing temperature as DBA/BDM resin does; however, they have different curing mechanisms, and thus different crosslinked networks. The content of MPSA has close relation with the integrated performance of cured composites. Compared with cured DBA/BDM resin, composites with suitable content of MPSA show obviously improved flexural strength and modulus as well as impact strength; in addition, all composites not only have lower dielectric constant and similar frequency dependence, more interestingly, they also exhibit better stability of frequency on dielectric loss. For thermal stability, the addition of MPSA to DBA/BDM resin significantly decreases the coefficient of thermal expansion, and improves the char yield at high temperature with a slightly reduced glass transition temperature. All these differences in macro-properties are attributed to the different crosslinked networks between MPSA/DBA/BDM composites and DBA/BDM resin.
first_indexed 2024-12-12T04:50:39Z
format Article
id doaj.art-3e20e00e8ac544f0b0eb07397467e911
institution Directory Open Access Journal
issn 1788-618X
language English
last_indexed 2024-12-12T04:50:39Z
publishDate 2011-06-01
publisher Budapest University of Technology
record_format Article
series eXPRESS Polymer Letters
spelling doaj.art-3e20e00e8ac544f0b0eb07397467e9112022-12-22T00:37:29ZengBudapest University of TechnologyeXPRESS Polymer Letters1788-618X2011-06-015655556810.3144/expresspolymlett.2011.54Preparation and properties of mesoporous silica/bismaleimide/diallylbisphenol composites with improved thermal stability, mechanical and dielectric propertiesNew composites with improved thermal stability, mechanical and dielectric properties were developed, which consist of 2,2'-diallylbisphenol A (DBA)/4,4'-bismaleimidodiphenylmethane (BDM) resin and a new kind of organic/inorganic mesoporous silica (MPSA). Typical properties (curing behavior and mechanism, thermal stability, mechanical and dielectric properties) of the composites were systematically investigated, and their origins were discussed. Results show that MPSA/DBA/BDM composites have similar curing temperature as DBA/BDM resin does; however, they have different curing mechanisms, and thus different crosslinked networks. The content of MPSA has close relation with the integrated performance of cured composites. Compared with cured DBA/BDM resin, composites with suitable content of MPSA show obviously improved flexural strength and modulus as well as impact strength; in addition, all composites not only have lower dielectric constant and similar frequency dependence, more interestingly, they also exhibit better stability of frequency on dielectric loss. For thermal stability, the addition of MPSA to DBA/BDM resin significantly decreases the coefficient of thermal expansion, and improves the char yield at high temperature with a slightly reduced glass transition temperature. All these differences in macro-properties are attributed to the different crosslinked networks between MPSA/DBA/BDM composites and DBA/BDM resin.http://www.expresspolymlett.com/letolt.php?file=EPL-0002192&mi=cdNanocompositesmeosoporous silicadielectric propertiesthermosetting resin
spellingShingle Preparation and properties of mesoporous silica/bismaleimide/diallylbisphenol composites with improved thermal stability, mechanical and dielectric properties
eXPRESS Polymer Letters
Nanocomposites
meosoporous silica
dielectric properties
thermosetting resin
title Preparation and properties of mesoporous silica/bismaleimide/diallylbisphenol composites with improved thermal stability, mechanical and dielectric properties
title_full Preparation and properties of mesoporous silica/bismaleimide/diallylbisphenol composites with improved thermal stability, mechanical and dielectric properties
title_fullStr Preparation and properties of mesoporous silica/bismaleimide/diallylbisphenol composites with improved thermal stability, mechanical and dielectric properties
title_full_unstemmed Preparation and properties of mesoporous silica/bismaleimide/diallylbisphenol composites with improved thermal stability, mechanical and dielectric properties
title_short Preparation and properties of mesoporous silica/bismaleimide/diallylbisphenol composites with improved thermal stability, mechanical and dielectric properties
title_sort preparation and properties of mesoporous silica bismaleimide diallylbisphenol composites with improved thermal stability mechanical and dielectric properties
topic Nanocomposites
meosoporous silica
dielectric properties
thermosetting resin
url http://www.expresspolymlett.com/letolt.php?file=EPL-0002192&mi=cd