A Thermal Actuated Bistable Structure for Generating On-Chip Shock Loads
In this paper, we propose a bistable shock structure based on the thermal actuation principle, which overcomes the response time limitation of heating and cooling in typical thermal actuators and enables a rapid release of energy. Thus, force with a steep rising edge can be applied on a target. Usin...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-04-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/13/4/569 |
| _version_ | 1797444840496037888 |
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| author | Runze Yu Dacheng Zhang |
| author_facet | Runze Yu Dacheng Zhang |
| author_sort | Runze Yu |
| collection | DOAJ |
| description | In this paper, we propose a bistable shock structure based on the thermal actuation principle, which overcomes the response time limitation of heating and cooling in typical thermal actuators and enables a rapid release of energy. Thus, force with a steep rising edge can be applied on a target. Using a bistable shock structure to generate on-chip shock loads, we propose an automated and resettable method for shock testing of microstructures. We characterize the microscale shock process by high-speed camera and finite element simulation (FEM). The method can simulate the dynamic response of key structures in MEMS devices under mechanical shock conditions, and therefore, can be used to evaluate shock fracture strength of microstructures. |
| first_indexed | 2024-03-09T13:17:17Z |
| format | Article |
| id | doaj.art-3edd8b2cef6a40c5a28f7cb4ef8a09fe |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-09T13:17:17Z |
| publishDate | 2022-04-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-3edd8b2cef6a40c5a28f7cb4ef8a09fe2023-11-30T21:34:01ZengMDPI AGMicromachines2072-666X2022-04-0113456910.3390/mi13040569A Thermal Actuated Bistable Structure for Generating On-Chip Shock LoadsRunze Yu0Dacheng Zhang1Institute of Microelectronics, Peking University, Beijing 100871, ChinaInstitute of Microelectronics, Peking University, Beijing 100871, ChinaIn this paper, we propose a bistable shock structure based on the thermal actuation principle, which overcomes the response time limitation of heating and cooling in typical thermal actuators and enables a rapid release of energy. Thus, force with a steep rising edge can be applied on a target. Using a bistable shock structure to generate on-chip shock loads, we propose an automated and resettable method for shock testing of microstructures. We characterize the microscale shock process by high-speed camera and finite element simulation (FEM). The method can simulate the dynamic response of key structures in MEMS devices under mechanical shock conditions, and therefore, can be used to evaluate shock fracture strength of microstructures.https://www.mdpi.com/2072-666X/13/4/569bistable structurethermal driveshock test |
| spellingShingle | Runze Yu Dacheng Zhang A Thermal Actuated Bistable Structure for Generating On-Chip Shock Loads Micromachines bistable structure thermal drive shock test |
| title | A Thermal Actuated Bistable Structure for Generating On-Chip Shock Loads |
| title_full | A Thermal Actuated Bistable Structure for Generating On-Chip Shock Loads |
| title_fullStr | A Thermal Actuated Bistable Structure for Generating On-Chip Shock Loads |
| title_full_unstemmed | A Thermal Actuated Bistable Structure for Generating On-Chip Shock Loads |
| title_short | A Thermal Actuated Bistable Structure for Generating On-Chip Shock Loads |
| title_sort | thermal actuated bistable structure for generating on chip shock loads |
| topic | bistable structure thermal drive shock test |
| url | https://www.mdpi.com/2072-666X/13/4/569 |
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