| Summary: | Background. The aim of the study is to determine a frequency integrating unfolding converter parameters based on a bridge circuit with semiconductor strain gages to compensate for the of the output signal error resulting from the strain gages parameter's technological spread and the effects of elevated temperature. Materials and methods. The work employs methods of semiconductor strain gauge analysis, electrical circuit calculations, mathematical modeling using specially developed programs to determine the temperature and process-induced error dependence of the output signal of a frequency integrating unfolding converter based on a bridge circuit with semiconductor strain gauges. Results. It is demonstrated that to reduce the multiplicative component of the temperature error in the output signal of the frequency integrating unfolding converter, it is proposed to use a temperature-dependent resistor for the integrator, made from the same semiconductor material as the strain gauges in the bridge circuit. The nominal resistance value and the temperature coefficient of resistance for the integrator resistor are determined iteratively based on the converter modeling results under the influence of elevated temperatures. Conclusions. Based on the calculations and modeling result’s analysis, it is concluded that the proposed technical solution is effective, since it allows to significantly reduce the additive and multiplicative components of the output signal error for frequency integrating unfolding converter.
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