A Novel Packaged Ultra-High Q Silicon MEMS Butterfly Vibratory Gyroscope
A novel three-dimensional (3D) wafer-level sandwich packaging technology is here applied in the dual mass MEMS butterfly vibratory gyroscope (BFVG) to achieve ultra-high Q factor. A GIS (glass in silicon) composite substrate with glass as the main body and low-resistance silicon column as the vertic...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-11-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/13/11/1967 |
| _version_ | 1797324116393459712 |
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| author | Lu Jia Guowei Han Zhenyu Wei Chaowei Si Jin Ning Fuhua Yang Weihua Han |
| author_facet | Lu Jia Guowei Han Zhenyu Wei Chaowei Si Jin Ning Fuhua Yang Weihua Han |
| author_sort | Lu Jia |
| collection | DOAJ |
| description | A novel three-dimensional (3D) wafer-level sandwich packaging technology is here applied in the dual mass MEMS butterfly vibratory gyroscope (BFVG) to achieve ultra-high Q factor. A GIS (glass in silicon) composite substrate with glass as the main body and low-resistance silicon column as the vertical lead is processed by glass reflow technology, which effectively avoids air leakage caused by thermal stress mismatch. Sputter getter material is used on the glass cap to further improve the vacuum degree. The Silicon-On-Insulator (SOI) gyroscope structure is sandwiched between the composite substrate and glass cap to realize vertical electrical interconnection by high-vacuum anodic bonding. The Q factors of drive and sense modes in BFVG measured by the self-developed double closed-loop circuit system are significantly improved to 8.628 times and 2.779 times higher than those of the traditional ceramic shell package. The experimental results of the processed gyroscope also demonstrate a high resolution of 0.1°/s, the scale factor of 1.302 mV/(°/s), and nonlinearity of 558 ppm in the full-scale range of ±1800°/s. By calculating the Allen variance, we obtained the angular random walk (ARW) of 1.281°/√h and low bias instability (BI) of 9.789°/h. The process error makes the actual drive and sense frequency of the gyroscope deviate by 8.989% and 5.367% compared with the simulation. |
| first_indexed | 2024-03-08T05:45:34Z |
| format | Article |
| id | doaj.art-3f8a0ac6836c415eba38883de1ef2357 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-08T05:45:34Z |
| publishDate | 2022-11-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-3f8a0ac6836c415eba38883de1ef23572024-02-05T10:50:57ZengMDPI AGMicromachines2072-666X2022-11-011311196710.3390/mi13111967A Novel Packaged Ultra-High Q Silicon MEMS Butterfly Vibratory GyroscopeLu Jia0Guowei Han1Zhenyu Wei2Chaowei Si3Jin Ning4Fuhua Yang5Weihua Han6Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, ChinaEngineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, ChinaEngineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, ChinaEngineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, ChinaEngineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, ChinaEngineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, ChinaEngineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, ChinaA novel three-dimensional (3D) wafer-level sandwich packaging technology is here applied in the dual mass MEMS butterfly vibratory gyroscope (BFVG) to achieve ultra-high Q factor. A GIS (glass in silicon) composite substrate with glass as the main body and low-resistance silicon column as the vertical lead is processed by glass reflow technology, which effectively avoids air leakage caused by thermal stress mismatch. Sputter getter material is used on the glass cap to further improve the vacuum degree. The Silicon-On-Insulator (SOI) gyroscope structure is sandwiched between the composite substrate and glass cap to realize vertical electrical interconnection by high-vacuum anodic bonding. The Q factors of drive and sense modes in BFVG measured by the self-developed double closed-loop circuit system are significantly improved to 8.628 times and 2.779 times higher than those of the traditional ceramic shell package. The experimental results of the processed gyroscope also demonstrate a high resolution of 0.1°/s, the scale factor of 1.302 mV/(°/s), and nonlinearity of 558 ppm in the full-scale range of ±1800°/s. By calculating the Allen variance, we obtained the angular random walk (ARW) of 1.281°/√h and low bias instability (BI) of 9.789°/h. The process error makes the actual drive and sense frequency of the gyroscope deviate by 8.989% and 5.367% compared with the simulation.https://www.mdpi.com/2072-666X/13/11/1967butterfly vibratory gyroscopewafer-level sandwich packagingultra-high Q factor |
| spellingShingle | Lu Jia Guowei Han Zhenyu Wei Chaowei Si Jin Ning Fuhua Yang Weihua Han A Novel Packaged Ultra-High Q Silicon MEMS Butterfly Vibratory Gyroscope Micromachines butterfly vibratory gyroscope wafer-level sandwich packaging ultra-high Q factor |
| title | A Novel Packaged Ultra-High Q Silicon MEMS Butterfly Vibratory Gyroscope |
| title_full | A Novel Packaged Ultra-High Q Silicon MEMS Butterfly Vibratory Gyroscope |
| title_fullStr | A Novel Packaged Ultra-High Q Silicon MEMS Butterfly Vibratory Gyroscope |
| title_full_unstemmed | A Novel Packaged Ultra-High Q Silicon MEMS Butterfly Vibratory Gyroscope |
| title_short | A Novel Packaged Ultra-High Q Silicon MEMS Butterfly Vibratory Gyroscope |
| title_sort | novel packaged ultra high q silicon mems butterfly vibratory gyroscope |
| topic | butterfly vibratory gyroscope wafer-level sandwich packaging ultra-high Q factor |
| url | https://www.mdpi.com/2072-666X/13/11/1967 |
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