High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating
This paper investigates a moiré-based mark for high-precision wafer bonding alignment. During alignment, the mark is combined with digital grating, which has the benefits of high precision and small size. A digital grating is superimposed on the mark to generate moiré fringes. By performing a phase...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-12-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/13/12/2159 |
| _version_ | 1827637663650283520 |
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| author | Jianhan Fan Sen Lu Jianxiao Zou Kaiming Yang Yu Zhu Kaiji Liao |
| author_facet | Jianhan Fan Sen Lu Jianxiao Zou Kaiming Yang Yu Zhu Kaiji Liao |
| author_sort | Jianhan Fan |
| collection | DOAJ |
| description | This paper investigates a moiré-based mark for high-precision wafer bonding alignment. During alignment, the mark is combined with digital grating, which has the benefits of high precision and small size. A digital grating is superimposed on the mark to generate moiré fringes. By performing a phase calculation on the moiré fringe images corresponding to the upper and lower wafers, the relative offset of the upper and lower wafers can be accurately calculated. These moiré fringes are exceptionally stable, thereby enhancing the alignment stability. In this study, through practical experiments, we tested the rationality and practicability of the mark. |
| first_indexed | 2024-03-09T16:04:59Z |
| format | Article |
| id | doaj.art-40294a8880fe400db3716d8f7ff55778 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-09T16:04:59Z |
| publishDate | 2022-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-40294a8880fe400db3716d8f7ff557782023-11-24T16:45:10ZengMDPI AGMicromachines2072-666X2022-12-011312215910.3390/mi13122159High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital GratingJianhan Fan0Sen Lu1Jianxiao Zou2Kaiming Yang3Yu Zhu4Kaiji Liao5School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu 611731, ChinaState Key Laboratory of Tribology, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, ChinaSchool of Automation Engineering, University of Electronic Science and Technology of China, Chengdu 611731, ChinaState Key Laboratory of Tribology, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, ChinaState Key Laboratory of Tribology, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, ChinaState Grid Sichuan Electric Power Corporation Metering Center, Wanjing Road I, Chengdu 610000, ChinaThis paper investigates a moiré-based mark for high-precision wafer bonding alignment. During alignment, the mark is combined with digital grating, which has the benefits of high precision and small size. A digital grating is superimposed on the mark to generate moiré fringes. By performing a phase calculation on the moiré fringe images corresponding to the upper and lower wafers, the relative offset of the upper and lower wafers can be accurately calculated. These moiré fringes are exceptionally stable, thereby enhancing the alignment stability. In this study, through practical experiments, we tested the rationality and practicability of the mark.https://www.mdpi.com/2072-666X/13/12/2159wafer bondingmoiré fringewafer bonding alignment |
| spellingShingle | Jianhan Fan Sen Lu Jianxiao Zou Kaiming Yang Yu Zhu Kaiji Liao High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating Micromachines wafer bonding moiré fringe wafer bonding alignment |
| title | High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating |
| title_full | High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating |
| title_fullStr | High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating |
| title_full_unstemmed | High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating |
| title_short | High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating |
| title_sort | high precision wafer bonding alignment mark using moire fringes and digital grating |
| topic | wafer bonding moiré fringe wafer bonding alignment |
| url | https://www.mdpi.com/2072-666X/13/12/2159 |
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