Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires
Owing to the increasing demand for the miniaturization and integration of electronic devices, thermal interface materials (TIMs) are crucial components for removing heat and improving the lifetime and safety of electronic devices. Among these, thermal pads are reusable alternatives to thermal paste-...
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MDPI AG
2023-07-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/16/14/5102 |
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| author | Kiho Song Junhyeok Choi Donghwi Cho In-Hwan Lee Changui Ahn |
| author_facet | Kiho Song Junhyeok Choi Donghwi Cho In-Hwan Lee Changui Ahn |
| author_sort | Kiho Song |
| collection | DOAJ |
| description | Owing to the increasing demand for the miniaturization and integration of electronic devices, thermal interface materials (TIMs) are crucial components for removing heat and improving the lifetime and safety of electronic devices. Among these, thermal pads are reusable alternatives to thermal paste-type TIMs; however, conventional thermal pads comprise a homogeneous polymer with low thermal conductivity. Composite materials of thermally conducting fillers and polymer matrices are considered suitable alternatives to high-performance pad materials owing to their controllable thermal properties. However, they degrade the thermal performance of the filler materials at high loading ratios via aggregation. In this study, we propose novel nanocomposites using densely aligned MgO nanowire fillers and polydimethylsiloxane (PDMS) matrices. The developed nanocomposites ensured the enhanced thermal conducting properties, while maintaining mechanical flexibility. The three-step preparation process involves the (i) fabrication of the MgO structure using a freeze dryer; (ii) compression of the MgO structure; and (iii) the infiltration of PDMS in the structure. The resulting aligned composites exhibited a superior thermal conductivity (approximately 1.18 W m<sup>−1</sup>K<sup>−1</sup>) to that of pure PDMS and composites with the same filler ratios of randomly distributed MgO fillers. Additionally, the MgO/PDMS composites exhibited adequate electrical insulating properties, with a room-temperature resistivity of 7.92 × 10<sup>15</sup> Ω∙cm. |
| first_indexed | 2024-03-11T00:52:41Z |
| format | Article |
| id | doaj.art-405523f062d7486caeecf85a58a93f8b |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-11T00:52:41Z |
| publishDate | 2023-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-405523f062d7486caeecf85a58a93f8b2023-11-18T20:18:02ZengMDPI AGMaterials1996-19442023-07-011614510210.3390/ma16145102Enhanced Thermal Pad Composites Using Densely Aligned MgO NanowiresKiho Song0Junhyeok Choi1Donghwi Cho2In-Hwan Lee3Changui Ahn4Engineering Ceramic Center, Korea Institute of Ceramic Engineering & Technology (KICET), Icheon 17303, Republic of KoreaEngineering Ceramic Center, Korea Institute of Ceramic Engineering & Technology (KICET), Icheon 17303, Republic of KoreaAdvanced Materials Division, Korea Research Institute of Chemical Technology (KRICT), Daejeon 34114, Republic of KoreaDepartment of Materials Science and Engineering, Korea University, Seoul 02841, Republic of KoreaEngineering Ceramic Center, Korea Institute of Ceramic Engineering & Technology (KICET), Icheon 17303, Republic of KoreaOwing to the increasing demand for the miniaturization and integration of electronic devices, thermal interface materials (TIMs) are crucial components for removing heat and improving the lifetime and safety of electronic devices. Among these, thermal pads are reusable alternatives to thermal paste-type TIMs; however, conventional thermal pads comprise a homogeneous polymer with low thermal conductivity. Composite materials of thermally conducting fillers and polymer matrices are considered suitable alternatives to high-performance pad materials owing to their controllable thermal properties. However, they degrade the thermal performance of the filler materials at high loading ratios via aggregation. In this study, we propose novel nanocomposites using densely aligned MgO nanowire fillers and polydimethylsiloxane (PDMS) matrices. The developed nanocomposites ensured the enhanced thermal conducting properties, while maintaining mechanical flexibility. The three-step preparation process involves the (i) fabrication of the MgO structure using a freeze dryer; (ii) compression of the MgO structure; and (iii) the infiltration of PDMS in the structure. The resulting aligned composites exhibited a superior thermal conductivity (approximately 1.18 W m<sup>−1</sup>K<sup>−1</sup>) to that of pure PDMS and composites with the same filler ratios of randomly distributed MgO fillers. Additionally, the MgO/PDMS composites exhibited adequate electrical insulating properties, with a room-temperature resistivity of 7.92 × 10<sup>15</sup> Ω∙cm.https://www.mdpi.com/1996-1944/16/14/5102thermal pad compositethermal conductivityaligned MgO nanowirethermal application |
| spellingShingle | Kiho Song Junhyeok Choi Donghwi Cho In-Hwan Lee Changui Ahn Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires Materials thermal pad composite thermal conductivity aligned MgO nanowire thermal application |
| title | Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires |
| title_full | Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires |
| title_fullStr | Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires |
| title_full_unstemmed | Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires |
| title_short | Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires |
| title_sort | enhanced thermal pad composites using densely aligned mgo nanowires |
| topic | thermal pad composite thermal conductivity aligned MgO nanowire thermal application |
| url | https://www.mdpi.com/1996-1944/16/14/5102 |
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