Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires

Owing to the increasing demand for the miniaturization and integration of electronic devices, thermal interface materials (TIMs) are crucial components for removing heat and improving the lifetime and safety of electronic devices. Among these, thermal pads are reusable alternatives to thermal paste-...

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Bibliographic Details
Main Authors: Kiho Song, Junhyeok Choi, Donghwi Cho, In-Hwan Lee, Changui Ahn
Format: Article
Language:English
Published: MDPI AG 2023-07-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/16/14/5102

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