Al2O3/glass/hBN composites with high thermal conductivity and low dielectric constant for low temperature cofired ceramic applications
Al2O3/glass/hBN composites were successfully fabricated for the LTCC applications. Alignment and homogeneous distribution of the platelet hBN particles during tape casting allowed high hBN (5 wt%) loading as well as facilitated densification at 800°C (density of 2.65 g/cm3, apparent porosity of 0.7%...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
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Taylor & Francis Group
2021-01-01
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| Series: | Journal of Asian Ceramic Societies |
| Subjects: | |
| Online Access: | http://dx.doi.org/10.1080/21870764.2020.1864897 |
| _version_ | 1819093586127355904 |
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| author | Oğuzhan Bilaç Cihangir Duran |
| author_facet | Oğuzhan Bilaç Cihangir Duran |
| author_sort | Oğuzhan Bilaç |
| collection | DOAJ |
| description | Al2O3/glass/hBN composites were successfully fabricated for the LTCC applications. Alignment and homogeneous distribution of the platelet hBN particles during tape casting allowed high hBN (5 wt%) loading as well as facilitated densification at 800°C (density of 2.65 g/cm3, apparent porosity of 0.7%). XRD results proved that hBN neither chemically reacted with the other phases nor decomposed with temperature, which was critical to increase thermal conductivity and at the same time to decrease dielectric constant. Dielectric constant of the dense composites decreased (or, alternatively, enhanced) with increasing hBN content from 7.3 for the 0 wt% hBN to 6.55 for the 5 wt% hBN at 5 MHz. In addition, hBN addition strongly improved the mean thermal conductivity from 1.86 W/m·K for the 0 wt% hBN to 2.43 W/m·K for the 5 wt% hBN between 75°C and 250°C. Therefore, the hBN phase itself effectively optimized both dielectric and thermal properties at the same time and made the Al2O3/glass/hBN composites a promising candidate for the LTCC applications. |
| first_indexed | 2024-12-21T23:13:52Z |
| format | Article |
| id | doaj.art-42b59757557642378fe9ff755814e114 |
| institution | Directory Open Access Journal |
| issn | 2187-0764 |
| language | English |
| last_indexed | 2024-12-21T23:13:52Z |
| publishDate | 2021-01-01 |
| publisher | Taylor & Francis Group |
| record_format | Article |
| series | Journal of Asian Ceramic Societies |
| spelling | doaj.art-42b59757557642378fe9ff755814e1142022-12-21T18:46:57ZengTaylor & Francis GroupJournal of Asian Ceramic Societies2187-07642021-01-019128329010.1080/21870764.2020.18648971864897Al2O3/glass/hBN composites with high thermal conductivity and low dielectric constant for low temperature cofired ceramic applicationsOğuzhan Bilaç0Cihangir Duran1Ankara Yıldırım Beyazıt UniversityAnkara Yıldırım Beyazıt UniversityAl2O3/glass/hBN composites were successfully fabricated for the LTCC applications. Alignment and homogeneous distribution of the platelet hBN particles during tape casting allowed high hBN (5 wt%) loading as well as facilitated densification at 800°C (density of 2.65 g/cm3, apparent porosity of 0.7%). XRD results proved that hBN neither chemically reacted with the other phases nor decomposed with temperature, which was critical to increase thermal conductivity and at the same time to decrease dielectric constant. Dielectric constant of the dense composites decreased (or, alternatively, enhanced) with increasing hBN content from 7.3 for the 0 wt% hBN to 6.55 for the 5 wt% hBN at 5 MHz. In addition, hBN addition strongly improved the mean thermal conductivity from 1.86 W/m·K for the 0 wt% hBN to 2.43 W/m·K for the 5 wt% hBN between 75°C and 250°C. Therefore, the hBN phase itself effectively optimized both dielectric and thermal properties at the same time and made the Al2O3/glass/hBN composites a promising candidate for the LTCC applications.http://dx.doi.org/10.1080/21870764.2020.1864897al2o3/glass compositehexagonal boron nitridelow temperature co-fired ceramicsthermal propertiesdielectric properties |
| spellingShingle | Oğuzhan Bilaç Cihangir Duran Al2O3/glass/hBN composites with high thermal conductivity and low dielectric constant for low temperature cofired ceramic applications Journal of Asian Ceramic Societies al2o3/glass composite hexagonal boron nitride low temperature co-fired ceramics thermal properties dielectric properties |
| title | Al2O3/glass/hBN composites with high thermal conductivity and low dielectric constant for low temperature cofired ceramic applications |
| title_full | Al2O3/glass/hBN composites with high thermal conductivity and low dielectric constant for low temperature cofired ceramic applications |
| title_fullStr | Al2O3/glass/hBN composites with high thermal conductivity and low dielectric constant for low temperature cofired ceramic applications |
| title_full_unstemmed | Al2O3/glass/hBN composites with high thermal conductivity and low dielectric constant for low temperature cofired ceramic applications |
| title_short | Al2O3/glass/hBN composites with high thermal conductivity and low dielectric constant for low temperature cofired ceramic applications |
| title_sort | al2o3 glass hbn composites with high thermal conductivity and low dielectric constant for low temperature cofired ceramic applications |
| topic | al2o3/glass composite hexagonal boron nitride low temperature co-fired ceramics thermal properties dielectric properties |
| url | http://dx.doi.org/10.1080/21870764.2020.1864897 |
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