Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs †

Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs †

We have developed a high-speed vision chip using 3D stacking technology to address the increasing demand for high-speed vision chips in diverse applications. The chip comprises a 1/3.2-inch, 1.27 Mpixel, 500 fps (0.31 Mpixel, 1000 fps, 2 × 2 binning) vision chip with 3D-stacked column-para...

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Bibliographic Details
Main Authors: Atsushi Nose, Tomohiro Yamazaki, Hironobu Katayama, Shuji Uehara, Masatsugu Kobayashi, Sayaka Shida, Masaki Odahara, Kenichi Takamiya, Shizunori Matsumoto, Leo Miyashita, Yoshihiro Watanabe, Takashi Izawa, Yoshinori Muramatsu, Yoshikazu Nitta, Masatoshi Ishikawa
Format: Article
Language:English
Published: MDPI AG 2018-04-01
Series:Sensors
Subjects:
vision chip
high-speed image sensor
detection
tracking
Online Access:http://www.mdpi.com/1424-8220/18/5/1313

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