New Self-Healing Dielectric for High-Reliability, High-Performance PCB-Embedding Materials for Power Electronics Applications
Printed Circuit Board (PCB)-embedded power electronics packages are anticipated as the next major packaging trend to support efficient and reliable electrical energy conversions. With many core aspects of the package being modified, the dielectric is now required to ensure new functions while still...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2023-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10330586/ |