Etching characteristics of Si{110} in 20 wt% KOH with addition of hydroxylamine for the fabrication of bulk micromachined MEMS

Etching characteristics of Si{110} in 20 wt% KOH with addition of hydroxylamine for the fabrication of bulk micromachined MEMS

Abstract Anisotropic wet etching is a most widely employed for the fabrication of MEMS/NEMS structures using silicon bulk micromachining. The use of Si{110} in MEMS is inevitable when a microstructure with vertical sidewall is to be fabricated using wet anisotropic etching. In most commonly employed...

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Bibliographic Details
Main Authors: A. V. Narasimha Rao, V. Swarnalatha, P. Pal
Format: Article
Language:English
Published: SpringerOpen 2017-05-01
Series:Micro and Nano Systems Letters
Subjects:
Wet anisotropic etching
Bulk micromachining
Silicon
Corner undercutting
KOH
MEMS
Online Access:http://link.springer.com/article/10.1186/s40486-017-0057-7

Internet

http://link.springer.com/article/10.1186/s40486-017-0057-7

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