Etching characteristics of Si{110} in 20 wt% KOH with addition of hydroxylamine for the fabrication of bulk micromachined MEMS
Abstract Anisotropic wet etching is a most widely employed for the fabrication of MEMS/NEMS structures using silicon bulk micromachining. The use of Si{110} in MEMS is inevitable when a microstructure with vertical sidewall is to be fabricated using wet anisotropic etching. In most commonly employed...
Main Authors: | A. V. Narasimha Rao, V. Swarnalatha, P. Pal |
---|---|
Format: | Article |
Language: | English |
Published: |
SpringerOpen
2017-05-01
|
Series: | Micro and Nano Systems Letters |
Subjects: | |
Online Access: | http://link.springer.com/article/10.1186/s40486-017-0057-7 |
Similar Items
-
High speed silicon wet anisotropic etching for applications in bulk micromachining: a review
by: Prem Pal, et al.
Published: (2021-02-01) -
Determination of precise crystallographic directions on Si{111} wafers using self-aligning pre-etched pattern
by: Avvaru Venkata Narasimha Rao, et al.
Published: (2018-06-01) -
Enhanced etching characteristics of Si{100} in NaOH-based two-component solution
by: V. Swarnalatha, et al.
Published: (2022-08-01) -
Lateral Fractal Formation by Crystallographic Silicon Micromachining
by: Lucas Johannes Kooijman, et al.
Published: (2023-02-01) -
Wet anisotropic etching characteristics of Si{111} in NaOH-based solution for silicon bulk micromachining
by: S. Purohit, et al.
Published: (2022-12-01)