Direct write of copper-graphene composite using micro-cold spray

Direct write of a new class of composite materials containing copper and graphene in the powder phase is described. The composite was synthesized using batch electroless plating of copper for various times onto Nano Graphene Platelets (NGP) to control the amount of copper deposited within the loosel...

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Main Authors: Sameh Dardona, Justin Hoey, Ying She, Wayde R. Schmidt
Format: Article
Language:English
Published: AIP Publishing LLC 2016-08-01
Series:AIP Advances
Online Access:http://dx.doi.org/10.1063/1.4961510
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author Sameh Dardona
Justin Hoey
Ying She
Wayde R. Schmidt
author_facet Sameh Dardona
Justin Hoey
Ying She
Wayde R. Schmidt
author_sort Sameh Dardona
collection DOAJ
description Direct write of a new class of composite materials containing copper and graphene in the powder phase is described. The composite was synthesized using batch electroless plating of copper for various times onto Nano Graphene Platelets (NGP) to control the amount of copper deposited within the loosely aggregated graphene powder. Copper deposition was confirmed by both Focused Ion Beam (FIB) and Auger electron spectroscopic analysis. A micro-cold spray technique was used to deposit traces that are ∼230 μm wide and ∼5 μm thick of the formulated copper/graphene powder onto a glass substrate. The deposited traces were found to have good adhesion to the substrate with ∼65x the copper bulk resistivity.
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spelling doaj.art-43920fce39b043de962bf5c0f6ed76bf2022-12-22T02:09:21ZengAIP Publishing LLCAIP Advances2158-32262016-08-0168085013085013-610.1063/1.4961510051608ADVDirect write of copper-graphene composite using micro-cold spraySameh Dardona0Justin Hoey1Ying She2Wayde R. Schmidt3Physical Sciences Department, United Technologies Research Center, East Hartford, CT, 06108, USACenter for Nanoscale Science and Engineering, North Dakota State University, Fargo, ND 58102, USAPhysical Sciences Department, United Technologies Research Center, East Hartford, CT, 06108, USAPhysical Sciences Department, United Technologies Research Center, East Hartford, CT, 06108, USADirect write of a new class of composite materials containing copper and graphene in the powder phase is described. The composite was synthesized using batch electroless plating of copper for various times onto Nano Graphene Platelets (NGP) to control the amount of copper deposited within the loosely aggregated graphene powder. Copper deposition was confirmed by both Focused Ion Beam (FIB) and Auger electron spectroscopic analysis. A micro-cold spray technique was used to deposit traces that are ∼230 μm wide and ∼5 μm thick of the formulated copper/graphene powder onto a glass substrate. The deposited traces were found to have good adhesion to the substrate with ∼65x the copper bulk resistivity.http://dx.doi.org/10.1063/1.4961510
spellingShingle Sameh Dardona
Justin Hoey
Ying She
Wayde R. Schmidt
Direct write of copper-graphene composite using micro-cold spray
AIP Advances
title Direct write of copper-graphene composite using micro-cold spray
title_full Direct write of copper-graphene composite using micro-cold spray
title_fullStr Direct write of copper-graphene composite using micro-cold spray
title_full_unstemmed Direct write of copper-graphene composite using micro-cold spray
title_short Direct write of copper-graphene composite using micro-cold spray
title_sort direct write of copper graphene composite using micro cold spray
url http://dx.doi.org/10.1063/1.4961510
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AT yingshe directwriteofcoppergraphenecompositeusingmicrocoldspray
AT wayderschmidt directwriteofcoppergraphenecompositeusingmicrocoldspray