Surface Form Accuracy Evaluation in Abrasive Lapping of Single-Crystal Silicon Wafers

Surface Form Accuracy Evaluation in Abrasive Lapping of Single-Crystal Silicon Wafers

Silicon-based materials still dominate the current semiconductor industry for the foreseeable years such that it is needed in continuously developing the related advanced manufacturing technologies. For the abrasive precision lapping of single-crystal silicon wafers, the surface form accuracy is ver...

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Bibliographic Details
Main Authors: Zhengwei Wang, Yang Lei, Xiaofeng Wu
Format: Article
Language:English
Published: Frontiers Media S.A. 2022-05-01
Series:Frontiers in Materials
Subjects:
surface form accuracy
single-side planetary lapping
irrational rotation speed ratio
particle trajectories
uniform distribution
Online Access:https://www.frontiersin.org/articles/10.3389/fmats.2022.901556/full

Internet

https://www.frontiersin.org/articles/10.3389/fmats.2022.901556/full

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