Surface Form Accuracy Evaluation in Abrasive Lapping of Single-Crystal Silicon Wafers
Silicon-based materials still dominate the current semiconductor industry for the foreseeable years such that it is needed in continuously developing the related advanced manufacturing technologies. For the abrasive precision lapping of single-crystal silicon wafers, the surface form accuracy is ver...
Main Authors: | Zhengwei Wang, Yang Lei, Xiaofeng Wu |
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Format: | Article |
Language: | English |
Published: |
Frontiers Media S.A.
2022-05-01
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Series: | Frontiers in Materials |
Subjects: | |
Online Access: | https://www.frontiersin.org/articles/10.3389/fmats.2022.901556/full |
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