A Method for Fast Au-Sn Bonding at Low Temperature Using Thermal Gradient

A Method for Fast Au-Sn Bonding at Low Temperature Using Thermal Gradient

Flip chip bonding technology on gold–tin (Au-Sn) microbumps for MEMS (Micro Electro Mechanical Systems) and 3D packaging is becoming increasingly important in the electronics industry. The main advantages of Au-Sn microbumps are a low electrical resistance, high electrical reliability, and fine pitc...

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Bibliographic Details
Main Authors: Wenchao Wang, Ziyu Liu, Delong Qiu, Zhiyuan Zhu, Na Yan, Shijin Ding, David Wei Zhang
Format: Article
Language:English
Published: MDPI AG 2023-12-01
Series:Micromachines
Subjects:
flip chip
Au-Sn
solid-state diffusion (SSD)
thermal gradient bonding (TGB)
intermetallic compound (IMC)
Online Access:https://www.mdpi.com/2072-666X/14/12/2242

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