The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide
Polyimide (PI) with ultra-high thermal resistance and stability is essential for application as a flexible substrate in electronic devices. Here, the Upilex-type polyimides, which contained flexibly “twisted” 4,4′-oxydianiline (ODA), have achieved various performance improvements via copolymerizatio...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-05-01
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| Series: | Polymers |
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| Online Access: | https://www.mdpi.com/2073-4360/15/10/2343 |
| _version_ | 1797598518690447360 |
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| author | Meng Lian Fei Zhao Jun Liu Faqin Tong Lingbin Meng Yongqi Yang Feng Zheng |
| author_facet | Meng Lian Fei Zhao Jun Liu Faqin Tong Lingbin Meng Yongqi Yang Feng Zheng |
| author_sort | Meng Lian |
| collection | DOAJ |
| description | Polyimide (PI) with ultra-high thermal resistance and stability is essential for application as a flexible substrate in electronic devices. Here, the Upilex-type polyimides, which contained flexibly “twisted” 4,4′-oxydianiline (ODA), have achieved various performance improvements via copolymerization with a diamine containing benzimidazole structure. With the rigid benzimidazole-based diamine bearing conjugated heterocyclic moieties and hydrogen bond donors fused into the PI backbone, the benzimidazole-containing PI showed outstanding thermal, mechanical, and dielectric performance. Specifically, the PI containing 50% bis-benzimidazole diamine achieved a 5% decomposition temperature at 554 °C, an excellent high glass transition temperature of 448 °C, and a coefficient of thermal expansion lowered to 16.1 ppm/K. Meanwhile, the tensile strength and modulus of the PI films containing 50% mono-benzimidazole diamine increased to 148.6 MPa and 4.1 GPa, respectively. Due to the synergistic effect of rigid benzimidazole and hinged, flexible ODA, all PI films exhibited an elongation at break above 4.3%. The electrical insulation of the PI films was also improved with a dielectric constant lowered to 1.29. In summary, with appropriate mixing of rigid and flexible moieties in the PI backbone, all the PI films showed superior thermal stability, excellent flexibility, and acceptable electrical insulation. |
| first_indexed | 2024-03-11T03:22:16Z |
| format | Article |
| id | doaj.art-44494dc92a374e97a47df17305485af5 |
| institution | Directory Open Access Journal |
| issn | 2073-4360 |
| language | English |
| last_indexed | 2024-03-11T03:22:16Z |
| publishDate | 2023-05-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Polymers |
| spelling | doaj.art-44494dc92a374e97a47df17305485af52023-11-18T02:58:42ZengMDPI AGPolymers2073-43602023-05-011510234310.3390/polym15102343The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type PolyimideMeng Lian0Fei Zhao1Jun Liu2Faqin Tong3Lingbin Meng4Yongqi Yang5Feng Zheng6Shandong Engineering Laboratory for Clean Utilization of Chemical Resources, Weifang University of Science and Technology, Weifang 262700, ChinaShandong Engineering Laboratory for Clean Utilization of Chemical Resources, Weifang University of Science and Technology, Weifang 262700, ChinaShandong Engineering Laboratory for Clean Utilization of Chemical Resources, Weifang University of Science and Technology, Weifang 262700, ChinaShanghai Sinochem Technology Co., Ltd., Kangwei Road 299, Pudong New District, Shanghai 201210, ChinaShandong Engineering Laboratory for Clean Utilization of Chemical Resources, Weifang University of Science and Technology, Weifang 262700, ChinaShandong Engineering Laboratory for Clean Utilization of Chemical Resources, Weifang University of Science and Technology, Weifang 262700, ChinaSchool of Chemical Science and Engineering, Tongji University, Siping Road 1239, Shanghai 200092, ChinaPolyimide (PI) with ultra-high thermal resistance and stability is essential for application as a flexible substrate in electronic devices. Here, the Upilex-type polyimides, which contained flexibly “twisted” 4,4′-oxydianiline (ODA), have achieved various performance improvements via copolymerization with a diamine containing benzimidazole structure. With the rigid benzimidazole-based diamine bearing conjugated heterocyclic moieties and hydrogen bond donors fused into the PI backbone, the benzimidazole-containing PI showed outstanding thermal, mechanical, and dielectric performance. Specifically, the PI containing 50% bis-benzimidazole diamine achieved a 5% decomposition temperature at 554 °C, an excellent high glass transition temperature of 448 °C, and a coefficient of thermal expansion lowered to 16.1 ppm/K. Meanwhile, the tensile strength and modulus of the PI films containing 50% mono-benzimidazole diamine increased to 148.6 MPa and 4.1 GPa, respectively. Due to the synergistic effect of rigid benzimidazole and hinged, flexible ODA, all PI films exhibited an elongation at break above 4.3%. The electrical insulation of the PI films was also improved with a dielectric constant lowered to 1.29. In summary, with appropriate mixing of rigid and flexible moieties in the PI backbone, all the PI films showed superior thermal stability, excellent flexibility, and acceptable electrical insulation.https://www.mdpi.com/2073-4360/15/10/2343upilex-type polyimidebenzimidazole-containing diamineconjugation systemhydrogen bond |
| spellingShingle | Meng Lian Fei Zhao Jun Liu Faqin Tong Lingbin Meng Yongqi Yang Feng Zheng The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide Polymers upilex-type polyimide benzimidazole-containing diamine conjugation system hydrogen bond |
| title | The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide |
| title_full | The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide |
| title_fullStr | The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide |
| title_full_unstemmed | The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide |
| title_short | The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide |
| title_sort | pivotal role of benzimidazole in improving the thermal and dielectric performance of upilex type polyimide |
| topic | upilex-type polyimide benzimidazole-containing diamine conjugation system hydrogen bond |
| url | https://www.mdpi.com/2073-4360/15/10/2343 |
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