Measurements of the weak bonding interfacial stiffness by using air-coupled ultrasound

An air-coupled ultrasonic method, focusing on the problem that weak bonding interface is difficult to accurately measure using conventional nondestructive testing technique, is proposed to evaluate the bond integrity. Based on the spring model and the potential function theory, a theoretical model i...

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Main Authors: Wen-Lin Wu, Xing-Guo Wang, Zhi-Cheng Huang, Nan-Xing Wu
Format: Article
Language:English
Published: AIP Publishing LLC 2017-12-01
Series:AIP Advances
Online Access:http://dx.doi.org/10.1063/1.5001248
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author Wen-Lin Wu
Xing-Guo Wang
Zhi-Cheng Huang
Nan-Xing Wu
author_facet Wen-Lin Wu
Xing-Guo Wang
Zhi-Cheng Huang
Nan-Xing Wu
author_sort Wen-Lin Wu
collection DOAJ
description An air-coupled ultrasonic method, focusing on the problem that weak bonding interface is difficult to accurately measure using conventional nondestructive testing technique, is proposed to evaluate the bond integrity. Based on the spring model and the potential function theory, a theoretical model is established to predict the through-transmission spectrum in double-layer adhesive structure. The result of a theoretical algorithm shows that all the resonant transmission peaks move towards higher frequency with the increase of the interfacial stiffness. The reason for these movements is related to either the normal stiffness (KN) or the transverse stiffness (KT). A method to optimize the measurement parameters (i.e. the incident angle and testing frequency) is put forward through analyzing the relationship between the resonant transmission peaks and the interfacial spring stiffness at the frequency below 1MHz. The air-coupled ultrasonic testing experiments at the normal and oblique incident angle respectively are carried out to verify the theoretical analysis and to accurately measure the interfacial stiffness of double-layer adhesive composite plate. The experimental results are good agreement with the results from the theoretical algorithm, and the relationship between bonding time and interfacial stiffness is presented at the end of this paper.
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spelling doaj.art-44dc1c25244e49bb9ca957774b56eaa72022-12-21T19:56:36ZengAIP Publishing LLCAIP Advances2158-32262017-12-01712125316125316-1410.1063/1.5001248057712ADVMeasurements of the weak bonding interfacial stiffness by using air-coupled ultrasoundWen-Lin Wu0Xing-Guo Wang1Zhi-Cheng Huang2Nan-Xing Wu3School of Mechanical and Electronic Engineering, Jingdezhen Ceramic Institute, Jingdezhen 333403, ChinaSchool of Mechanical and Electronic Engineering, Jingdezhen Ceramic Institute, Jingdezhen 333403, ChinaSchool of Mechanical and Electronic Engineering, Jingdezhen Ceramic Institute, Jingdezhen 333403, ChinaSchool of Mechanical and Electronic Engineering, Jingdezhen Ceramic Institute, Jingdezhen 333403, ChinaAn air-coupled ultrasonic method, focusing on the problem that weak bonding interface is difficult to accurately measure using conventional nondestructive testing technique, is proposed to evaluate the bond integrity. Based on the spring model and the potential function theory, a theoretical model is established to predict the through-transmission spectrum in double-layer adhesive structure. The result of a theoretical algorithm shows that all the resonant transmission peaks move towards higher frequency with the increase of the interfacial stiffness. The reason for these movements is related to either the normal stiffness (KN) or the transverse stiffness (KT). A method to optimize the measurement parameters (i.e. the incident angle and testing frequency) is put forward through analyzing the relationship between the resonant transmission peaks and the interfacial spring stiffness at the frequency below 1MHz. The air-coupled ultrasonic testing experiments at the normal and oblique incident angle respectively are carried out to verify the theoretical analysis and to accurately measure the interfacial stiffness of double-layer adhesive composite plate. The experimental results are good agreement with the results from the theoretical algorithm, and the relationship between bonding time and interfacial stiffness is presented at the end of this paper.http://dx.doi.org/10.1063/1.5001248
spellingShingle Wen-Lin Wu
Xing-Guo Wang
Zhi-Cheng Huang
Nan-Xing Wu
Measurements of the weak bonding interfacial stiffness by using air-coupled ultrasound
AIP Advances
title Measurements of the weak bonding interfacial stiffness by using air-coupled ultrasound
title_full Measurements of the weak bonding interfacial stiffness by using air-coupled ultrasound
title_fullStr Measurements of the weak bonding interfacial stiffness by using air-coupled ultrasound
title_full_unstemmed Measurements of the weak bonding interfacial stiffness by using air-coupled ultrasound
title_short Measurements of the weak bonding interfacial stiffness by using air-coupled ultrasound
title_sort measurements of the weak bonding interfacial stiffness by using air coupled ultrasound
url http://dx.doi.org/10.1063/1.5001248
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