Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes

The configuration of a continuous and oriented thermal pathway is essential for efficient heat dissipation in the oriented direction. Three-dimensional (3D) conductive filler structures provide a suitable approach for constructing continuous thermal pathways in polymer-based composites. The aluminum...

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Bibliographic Details
Main Authors: Jooyoung Lee, Wonyoung Yang, Geunhyeong Lee, Youngsung Cho, Jooheon Kim
Format: Article
Language:English
Published: MDPI AG 2023-07-01
Series:Nanomaterials
Subjects:
Online Access:https://www.mdpi.com/2079-4991/13/15/2154