Copper Surface Treatment in Metal-Polymer Direct Molding Technology
The preparation technology of micro-nano structure on copper surface is studied and optimized. Aqueous solution containing sodium carbonate and sodium molybdate is used as electrolyte, and the copper sample is anodized at a constant voltage to form a layer of oxidation on the copper surface. Then, t...
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Format: | Article |
Language: | zho |
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Editorial Office of Journal of Shanghai Jiao Tong University
2021-01-01
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Series: | Shanghai Jiaotong Daxue xuebao |
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Online Access: | http://xuebao.sjtu.edu.cn/CN/10.16183/j.cnki.jsjtu.2019.185 |
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author | GUO Rongsheng HU Guanghong RONG Jian WANG Yuanlong |
author_facet | GUO Rongsheng HU Guanghong RONG Jian WANG Yuanlong |
author_sort | GUO Rongsheng |
collection | DOAJ |
description | The preparation technology of micro-nano structure on copper surface is studied and optimized. Aqueous solution containing sodium carbonate and sodium molybdate is used as electrolyte, and the copper sample is anodized at a constant voltage to form a layer of oxidation on the copper surface. Then, the copper surface is treated with aqueous solution containing phosphate and sodium dihydrogen phosphate as corrosion solution to obtain a micro-nano structure on the copper. The surface is observed by using a scanning electron microscope. Finally, the analysis software is used to analyze the scanning electron microscope image to calculate the micro-nano structure pores on the copper surface. The results show that when the anodizing voltage is 15 V, the anodizing time is 20 min, the phosphoric acid mass fraction is 20%, and the corrosion time is 30 min, the copper surface is relatively smooth, and the porosity reaches 25.77%. Orthogonal experiments demonstrate that the type, concentration of the corrosive solution, and etching time have a great effect, while the anodizing electrolyte, voltage and electrolysis have no significant effect on the porosity. Using a combination of anodic oxidation and chemical corrosion, micro and nano junctions with uniform and high porosity can be prepared on the copper surface. |
first_indexed | 2024-12-20T16:45:58Z |
format | Article |
id | doaj.art-46ddab8adea24df78147d8b740fffe01 |
institution | Directory Open Access Journal |
issn | 1006-2467 |
language | zho |
last_indexed | 2024-12-20T16:45:58Z |
publishDate | 2021-01-01 |
publisher | Editorial Office of Journal of Shanghai Jiao Tong University |
record_format | Article |
series | Shanghai Jiaotong Daxue xuebao |
spelling | doaj.art-46ddab8adea24df78147d8b740fffe012022-12-21T19:32:55ZzhoEditorial Office of Journal of Shanghai Jiao Tong UniversityShanghai Jiaotong Daxue xuebao1006-24672021-01-0155019610210.16183/j.cnki.jsjtu.2019.1851006-2467(2021)01-0096-07Copper Surface Treatment in Metal-Polymer Direct Molding TechnologyGUO RongshengHU GuanghongRONG JianWANG YuanlongThe preparation technology of micro-nano structure on copper surface is studied and optimized. Aqueous solution containing sodium carbonate and sodium molybdate is used as electrolyte, and the copper sample is anodized at a constant voltage to form a layer of oxidation on the copper surface. Then, the copper surface is treated with aqueous solution containing phosphate and sodium dihydrogen phosphate as corrosion solution to obtain a micro-nano structure on the copper. The surface is observed by using a scanning electron microscope. Finally, the analysis software is used to analyze the scanning electron microscope image to calculate the micro-nano structure pores on the copper surface. The results show that when the anodizing voltage is 15 V, the anodizing time is 20 min, the phosphoric acid mass fraction is 20%, and the corrosion time is 30 min, the copper surface is relatively smooth, and the porosity reaches 25.77%. Orthogonal experiments demonstrate that the type, concentration of the corrosive solution, and etching time have a great effect, while the anodizing electrolyte, voltage and electrolysis have no significant effect on the porosity. Using a combination of anodic oxidation and chemical corrosion, micro and nano junctions with uniform and high porosity can be prepared on the copper surface.http://xuebao.sjtu.edu.cn/CN/10.16183/j.cnki.jsjtu.2019.185coppersurface treatmentnano injection moldinganodic oxidationmicro-nano structure |
spellingShingle | GUO Rongsheng HU Guanghong RONG Jian WANG Yuanlong Copper Surface Treatment in Metal-Polymer Direct Molding Technology Shanghai Jiaotong Daxue xuebao copper surface treatment nano injection molding anodic oxidation micro-nano structure |
title | Copper Surface Treatment in Metal-Polymer Direct Molding Technology |
title_full | Copper Surface Treatment in Metal-Polymer Direct Molding Technology |
title_fullStr | Copper Surface Treatment in Metal-Polymer Direct Molding Technology |
title_full_unstemmed | Copper Surface Treatment in Metal-Polymer Direct Molding Technology |
title_short | Copper Surface Treatment in Metal-Polymer Direct Molding Technology |
title_sort | copper surface treatment in metal polymer direct molding technology |
topic | copper surface treatment nano injection molding anodic oxidation micro-nano structure |
url | http://xuebao.sjtu.edu.cn/CN/10.16183/j.cnki.jsjtu.2019.185 |
work_keys_str_mv | AT guorongsheng coppersurfacetreatmentinmetalpolymerdirectmoldingtechnology AT huguanghong coppersurfacetreatmentinmetalpolymerdirectmoldingtechnology AT rongjian coppersurfacetreatmentinmetalpolymerdirectmoldingtechnology AT wangyuanlong coppersurfacetreatmentinmetalpolymerdirectmoldingtechnology |