Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface

Hard and brittle materials such as monocrystalline silicon still occupy an important position in the semiconductor industry, but hard and brittle materials are difficult to process because of their physical properties. Fixed-diamond abrasive wire-saw cutting is the most widely used method for slicin...

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Bibliographic Details
Main Authors: Lie Liang, Shujuan Li, Kehao Lan, Ruijiang Yu, Jiabin Wang, Wen Zhao
Format: Article
Language:English
Published: MDPI AG 2023-05-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/16/10/3619