Encapsulation of power electronics components for operation in harsh environments
This paper reports on analyses and testing of sensitive power electronics components encapsulation concept, enabling operation in harsh, especially high pressure environments. The paper describes development of the concept of epoxy modules that can be used for protecting of the power electronics com...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Polish Academy of Sciences
2017-12-01
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| Series: | Archives of Electrical Engineering |
| Subjects: | |
| Online Access: | http://www.degruyter.com/view/j/aee.2017.66.issue-4/aee-2017-0065/aee-2017-0065.xml?format=INT |
| _version_ | 1828797189767299072 |
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| author | Stosur Mariusz Sowa Kacper Piasecki Wojciech Płatek Robert Balcerek Przemysław |
| author_facet | Stosur Mariusz Sowa Kacper Piasecki Wojciech Płatek Robert Balcerek Przemysław |
| author_sort | Stosur Mariusz |
| collection | DOAJ |
| description | This paper reports on analyses and testing of sensitive power electronics components encapsulation concept, enabling operation in harsh, especially high pressure environments. The paper describes development of the concept of epoxy modules that can be used for protecting of the power electronics components against harsh environmental conditions. It covers modeling of the protective capsules using a simple analytical approach and Finite Element Method (FEM) models and validation of the developed models with the high pressure tests on samples fabricated. The analyses covered two types of the epoxy modules: of sphere- and elongated- shape, both with electrical penetrators that enable electrical connection of the encapsulated components with external power sources as well as other power modules and components. The tests were conducted in a pressure chamber, with a maximum applied pressure of 310 bars, for which online strain measurements have been conducted. The experimental results were compared with the simulation results obtained with analytical and FEM models, providing validation of the models employed. The experimental part of this work was conducted in collaboration with Polish Naval Academy in Gdynia. |
| first_indexed | 2024-12-12T04:35:50Z |
| format | Article |
| id | doaj.art-4745807a90234a5cbaf5e2417c461ba7 |
| institution | Directory Open Access Journal |
| issn | 2300-2506 |
| language | English |
| last_indexed | 2024-12-12T04:35:50Z |
| publishDate | 2017-12-01 |
| publisher | Polish Academy of Sciences |
| record_format | Article |
| series | Archives of Electrical Engineering |
| spelling | doaj.art-4745807a90234a5cbaf5e2417c461ba72022-12-22T00:37:57ZengPolish Academy of SciencesArchives of Electrical Engineering2300-25062017-12-0166485586610.1515/aee-2017-0065aee-2017-0065Encapsulation of power electronics components for operation in harsh environmentsStosur Mariusz0Sowa Kacper1Piasecki Wojciech2Płatek Robert3Balcerek Przemysław4ABB Sp. z o.o., Corporate Research Center Starowiślna 13A, 31-038 Kraków, PolandABB Sp. z o.o., Corporate Research Center Starowiślna 13A, 31-038 Kraków, PolandABB Sp. z o.o., Corporate Research Center Starowiślna 13A, 31-038 Kraków, PolandABB Sp. z o.o., Corporate Research Center Starowiślna 13A, 31-038 Kraków, PolandABB Sp. z o.o., Corporate Research Center Starowiślna 13A, 31-038 Kraków, PolandThis paper reports on analyses and testing of sensitive power electronics components encapsulation concept, enabling operation in harsh, especially high pressure environments. The paper describes development of the concept of epoxy modules that can be used for protecting of the power electronics components against harsh environmental conditions. It covers modeling of the protective capsules using a simple analytical approach and Finite Element Method (FEM) models and validation of the developed models with the high pressure tests on samples fabricated. The analyses covered two types of the epoxy modules: of sphere- and elongated- shape, both with electrical penetrators that enable electrical connection of the encapsulated components with external power sources as well as other power modules and components. The tests were conducted in a pressure chamber, with a maximum applied pressure of 310 bars, for which online strain measurements have been conducted. The experimental results were compared with the simulation results obtained with analytical and FEM models, providing validation of the models employed. The experimental part of this work was conducted in collaboration with Polish Naval Academy in Gdynia.http://www.degruyter.com/view/j/aee.2017.66.issue-4/aee-2017-0065/aee-2017-0065.xml?format=INTpassive componentsencapsulationepoxyhigh pressuremeasurementsharsh environments |
| spellingShingle | Stosur Mariusz Sowa Kacper Piasecki Wojciech Płatek Robert Balcerek Przemysław Encapsulation of power electronics components for operation in harsh environments Archives of Electrical Engineering passive components encapsulation epoxy high pressure measurements harsh environments |
| title | Encapsulation of power electronics components for operation in harsh environments |
| title_full | Encapsulation of power electronics components for operation in harsh environments |
| title_fullStr | Encapsulation of power electronics components for operation in harsh environments |
| title_full_unstemmed | Encapsulation of power electronics components for operation in harsh environments |
| title_short | Encapsulation of power electronics components for operation in harsh environments |
| title_sort | encapsulation of power electronics components for operation in harsh environments |
| topic | passive components encapsulation epoxy high pressure measurements harsh environments |
| url | http://www.degruyter.com/view/j/aee.2017.66.issue-4/aee-2017-0065/aee-2017-0065.xml?format=INT |
| work_keys_str_mv | AT stosurmariusz encapsulationofpowerelectronicscomponentsforoperationinharshenvironments AT sowakacper encapsulationofpowerelectronicscomponentsforoperationinharshenvironments AT piaseckiwojciech encapsulationofpowerelectronicscomponentsforoperationinharshenvironments AT płatekrobert encapsulationofpowerelectronicscomponentsforoperationinharshenvironments AT balcerekprzemysław encapsulationofpowerelectronicscomponentsforoperationinharshenvironments |